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State detection method and state detection device

A state detection device and state detection technology, applied in the field of defect detection, can solve the problems of unable to measure and analyze the surface electrical properties of products, time-consuming, error analysis, etc.

Pending Publication Date: 2022-02-08
HOSIN GLOBAL ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, the devices produced through SIP packaging are in a sealed state after forming, and developers or testers cannot directly measure and analyze the electrical properties of the product surface
Therefore, when these types of memory storage devices are processed and verified before leaving the factory, if they encounter problems and become defective products, these defective products often cannot be directly analyzed for errors in the processing and verification factory. Only when good products are shipped back to the original factory can the original factory engineer perform manual analysis and error handling
However, the delivery of defective products often takes a lot of time, and even in the case of a large number of defective products, it may cause delays in product shipments

Method used

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  • State detection method and state detection device
  • State detection method and state detection device
  • State detection method and state detection device

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Embodiment Construction

[0009] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0010] figure 1 is a schematic diagram of a state detection system according to an embodiment of the present invention. Please refer to figure 1 , the state inspection system (also called state inspection system) 10 may include a state inspection device (also called defect state inspection device) 11 and a memory storage device 12 . For example, the status detection device 11 can be various electronic devices that can be connected to the memory storage device 12 and access the memory storage device 12 , such as a tablet computer, a notebook computer, a personal computer, an industrial computer, or a server. In addition, the memory storage device 12 can be various memory storage devices f...

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Abstract

The invention provides a state detection method and a state detection device, which are used for detecting the state of a memory storage device. The method comprises the following steps: establishing a connection line with the memory storage device; executing a first detection program on the memory storage device to perform initial error classification on the memory storage device; executing a second detection program on the memory storage device according to a classification result of the initial error classification; and providing detection data according to a detection result of the second detection program, wherein the detection data reflects a defect state of the memory storage device. Therefore, the state detection efficiency of the memory storage device can be effectively improved.

Description

technical field [0001] The invention relates to a defect detection technology, and in particular to a state detection method and a state detection device. Background technique [0002] Certain types of memory storage devices (such as USB flash drives) are mainly produced through a packaging process, which may include System in Package (SIP) packaging. However, the devices produced through SIP packaging are in a sealed state after forming, and developers or testers cannot directly measure and analyze the electrical properties of the product surface. Therefore, when these types of memory storage devices are processed and verified before leaving the factory, if they encounter problems and become defective products, these defective products often cannot be directly analyzed for errors in the processing and verification factory. Only when good products are shipped back to the original factory can the engineers of the original factory conduct manual analysis and error handling. ...

Claims

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Application Information

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IPC IPC(8): G11C29/56G11C29/44
CPCG11C29/56008G11C29/44G11C2029/5604G11C2029/4402
Inventor 张嘉祐
Owner HOSIN GLOBAL ELECTRONICS CO LTD
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