Circuit board with embedded component, and manufacturing method thereof

A technology of embedded components and manufacturing methods, which is applied in the direction of assembling printed circuits with electrical components, manufacturing printed circuits, and multilayer circuit manufacturing, and can solve complex manufacturing processes, poor thermal conductivity of multilayer boards, and uneven layers of multilayer boards. Qi and other problems, to achieve the effect of good combination performance, good heat dissipation effect, and favorable installation

Pending Publication Date: 2022-02-01
QING DING PRECISION ELECTRONICS HUAIAN CO LTD +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing manufacturing method of multi-layer boards with embedded components is complicated in the manufacturing process, for example, the layers of multi-layer boards need to be stacked to be uneven, which is not conducive to the installation of components; and the thermal conductivity of the manufactured multi-layer boards is poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board with embedded component, and manufacturing method thereof
  • Circuit board with embedded component, and manufacturing method thereof
  • Circuit board with embedded component, and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0061] In order to more clearly understand the above objects, features and advantages of the present application, the present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. A lot of specific details are set forth in the following description to facilitate a full understanding of the application, and the described implementations are only a part of the implementations of the application, but not all of the implementations. Based on the implementation manners in this application, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0062] Unless otherwise defined, all technical and scientific terms used herein have the same meaning...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A manufacturing method of a circuit board with an embedded component comprises the following steps of: providing a multi-layer circuit board, wherein the multi-layer circuit board comprises a first circuit substrate and a second circuit substrate which are stacked in the first direction, the multi-layer circuit board comprises a plurality of openings, each opening penetrates through the second circuit substrate in the first direction, and the farther the distance from the first circuit substrate is, the larger the diameter of the openings is; cutting along an area surrounded by the openings to form an accommodating space, wherein the accommodating space communicates with the openings; placing the component in the accommodating space, and electrically connecting the component with the first circuit substrate; and filling a gap between the component and the second circuit substrate with colloid to obtain the circuit board with the embedded component. The invention further provides the circuit board with the embedded component manufactured by adopting the manufacturing method.

Description

technical field [0001] The present application relates to the field of circuit board manufacturing, and in particular to a method for manufacturing a circuit board with embedded components and a circuit board with embedded components. Background technique [0002] With the increase of people's demand for various electronic products such as computers, consumer electronics and communications, the functions of electronic products are diversified, and the packaging structure of electronic products is becoming more and more centralized, such as embedding components in multilayer circuit boards middle. [0003] The existing manufacturing method of multi-layer boards with embedded components has complex manufacturing process, for example, stacked multi-layer boards need uneven layers, which is not conducive to the installation of components; and the thermal conductivity of the manufactured multi-layer boards is poor. Contents of the invention [0004] In view of this, it is nece...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/11
CPCH05K3/4611H05K3/4697H05K1/111H05K2201/10416H05K1/183H05K3/4614H05K2201/096H05K3/403H05K1/113H05K1/112H05K3/30
Inventor 高琳洁魏永超
Owner QING DING PRECISION ELECTRONICS HUAIAN CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap