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Silicon wafer, cleaning method thereof and solar cell

A solar cell and cleaning technology, applied in the field of solar cells, can solve the problems of large loss of silicon wafers and difficult to control the degree of cleaning, and achieve the effect of reducing loss, ensuring quality, efficient and selective cleaning

Pending Publication Date: 2022-01-21
HENGDIAN GRP DMEGC MAGNETICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is more difficult to control the degree of cleaning by using alkaline cleaning solution at high temperature, and the loss of silicon wafers will also be greater

Method used

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  • Silicon wafer, cleaning method thereof and solar cell
  • Silicon wafer, cleaning method thereof and solar cell

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Experimental program
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Effect test

Embodiment 1

[0044] This embodiment provides a cleaning method for a silicon wafer, the cleaning method comprising the steps of:

[0045] (1) place the silicon chip with oil on the surface to oxidize in the air for 6 hours to obtain a silicon oxide chip;

[0046] (2) Pass into the mixed gas of carbon tetrafluoride and oxygen, step (1) gained silicon oxide chip is etched, the time is 750s, and temperature is 120 ℃, and the pressure of gas is 250Mpa, obtains etching silicon chip; The gas flow of fluorocarbon is 2500L / min, and the gas flow of said oxygen is 60L / min;

[0047] (3) Pickling the etched silicon wafer obtained in step (2) for 120 s with a mixed solution of hydrofluoric acid and hydrochloric acid, the pH range of the pickling solution is 4-6, and the cleaning of the silicon wafer is completed.

Embodiment 2

[0049] This embodiment provides a cleaning method for a silicon wafer, the cleaning method comprising the steps of:

[0050] (1) place the silicon chip with oil on the surface to oxidize in the air for 5 hours to obtain a silicon oxide chip;

[0051] (2) Feed a mixed gas of nitrogen trifluoride and oxygen, and etch the silicon oxide sheet obtained in step (1), the time is 600s, the temperature is 140°C, and the pressure of the gas is 300Mpa to obtain an etched silicon sheet; the three The gas flow of nitrogen fluoride is 2400L / min, and the gas flow of said oxygen is 50L / min;

[0052] (3) Pickling the etched silicon wafer obtained in step (2) with hydrofluoric acid for 100 s, the pH range of the pickling solution is 4-6, and the cleaning of the silicon wafer is completed.

Embodiment 3

[0054] This embodiment provides a cleaning method for a silicon wafer, the cleaning method comprising the steps of:

[0055] (1) place the silicon chip with oil on the surface to oxidize in the air for 7 hours to obtain a silicon oxide chip;

[0056] (2) Feed a mixed gas of trifluoromethane and oxygen, and etch the silicon oxide wafer obtained in step (1), the time is 800s, the temperature is 90°C, and the pressure of the gas is 200Mpa to obtain an etched silicon wafer; The gas flow of methane is 2500L / min, and the gas flow of said oxygen is 60L / min;

[0057] (3) Pickling the etched silicon wafer obtained in step (2) with hydrochloric acid for 140 s, the pH range of the pickling solution is 4-6, and the volume ratio of the mixed solution is to complete the cleaning of the silicon wafer.

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PUM

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Abstract

The invention provides a silicon wafer, a cleaning method thereof and a solar cell, and the cleaning method comprises the following steps: (1) oxidizing a silicon wafer with greasy dirt on the surface to obtain an oxidized silicon wafer; (2) introducing etching gas, and etching the oxidized silicon wafer obtained in the step (1) to obtain an etched silicon wafer; and (3) pickling the etched silicon wafer obtained in the step (2) to complete cleaning of the silicon wafer. According to the method, organic matter on the surface of the silicon wafer is effectively removed through the technological methods of oxidation, etching and pickling solution cleaning, the yield of manufactured silicon wafers is increased, and the rework proportion is reduced. Through the etching process, the organic matters on the surface of the silicon wafer are selectively oxidized and removed, and other parts on the surface of the silicon wafer are not influenced, so that the quality of the silicon wafer is ensured, and the loss is reduced.

Description

technical field [0001] The invention belongs to the technical field of solar cells, and relates to a method for cleaning a silicon wafer, in particular to a silicon wafer, its cleaning method and a solar cell. Background technique [0002] In the production and manufacture of solar cells, one of the biggest ways to generate benefits is to increase the pass rate and high-quality rate of products and reduce costs; reducing production costs can be accomplished by improving material costs, increasing production capacity, and reducing single-chip costs. To improve the high-quality rate, it is necessary to improve the process method and improve the quality. One of the common problems in solar production lines is that organic substances such as fingerprints and oil stains adhere to the surface of silicon wafers. The normal cleaning process cannot clean the organic matter, and the phenomenon becomes more and more obvious after cleaning, which affects the quality of the product. In...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/02054
Inventor 郑正明马菁何悦
Owner HENGDIAN GRP DMEGC MAGNETICS CO LTD
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