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Double-sided scrubbing device for wafer processing

A double-sided, wafer technology, applied in the cleaning method using tools, the cleaning method using liquid, and the arrangement of drying gas, etc., can solve the problems of easy re-adsorption of impurities, low brushing efficiency, and inability to brush the wafer, etc. Brushing effect, improve brushing efficiency, avoid the effect of re-adsorbing impurities

Inactive Publication Date: 2022-01-14
无锡亚电智能装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The wafer will be displaced during the scrubbing process, which will affect the smooth progress of subsequent operations;
[0005] 2. It is impossible to scrub both sides of the wafer at the same time, and the scrubbing efficiency is low;
[0006] 3. A large amount of water droplets adhere to the surface of the wafer after scrubbing, and it is easy to absorb impurities again

Method used

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  • Double-sided scrubbing device for wafer processing
  • Double-sided scrubbing device for wafer processing
  • Double-sided scrubbing device for wafer processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Such as figure 1 , image 3 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 As shown, a double-sided brushing device for wafer processing includes a water supply mechanism 1 for providing water resources for brushing, a filter mechanism 2 for filtering sewage, and a support mechanism 3 for supporting the upper equipment. A filter mechanism 2 is installed above the water supply mechanism 1, and a support mechanism 3 is arranged above the filter mechanism 2, and also includes a mounting mechanism 4 for installing the wafer 404, a scrubbing mechanism 5 for simultaneously scrubbing both sides of the wafer 404, and a The drying mechanism 6 for drying the scrubbed wafer 404, the installation mechanism 4 is fixed above the support mechanism 3, the scrubbing mechanism 5 is arranged above the installation mechanism 4, and the drying mechanism 6 is fixed on both sides of the scrubbing mechanism 5;

[0052] The mounting mechanism 4 includes a mounting seat 401, a...

Embodiment 2

[0058] Such as figure 2 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 As shown, the difference between Embodiment 2 and Embodiment 1 is that the fixed plate 5011 and the fixed rod 5012 are replaced by a cross bar 5013 and a fixed plate 5014. The equipment is supported to ensure the smooth progress of the scrubbing operation.

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Abstract

The invention discloses a double-sided scrubbing device for wafer processing. The double-sided scrubbing device comprises a water supply mechanism for providing water resources for scrubbing, a filtering mechanism for filtering waste water, and a supporting mechanism for supporting equipment above, wherein the filtering mechanism is arranged above the water supply mechanism, and the supporting mechanism is arranged above the filtering mechanism; and the double-sided scrubbing device further comprises a mounting mechanism for mounting a wafer, a scrubbing mechanism for scrubbing the two surfaces of the wafer at the same time, and drying mechanisms for drying the scrubbed wafer, wherein the mounting mechanism is fixed above the supporting mechanism, the scrubbing mechanism is arranged above the mounting mechanism, and the drying mechanisms are fixed to the two sides of the scrubbing mechanism. According to the double-sided scrubbing device, by arranging the mounting mechanism, a first motor drives a driving roller to rotate through a rotating shaft, and a driving roller rotates to drive the wafer to rotate so that the wafer can be comprehensively scrubbed, and the scrubbing effect of the wafer is effectively improved.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a double-sided scrubbing device for wafer processing. Background technique [0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its circular shape, it is called wafer. Wafer is the carrier used in the production of integrated circuits. Generally speaking, wafer refers to single crystal silicon wafer. Single crystal silicon wafers are drawn and refined from ordinary silica sand, and are made into single crystal silicon rods through a series of measures of dissolution, purification and distillation. After the single crystal silicon rods are polished and sliced, they become wafers. [0003] A scrubbing device is required for wafer production, and the existing scrubbing devices have the following problems to be solved urgently: [0004] 1. The wafer will be displaced during the scrubbing process, which w...

Claims

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Application Information

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IPC IPC(8): B08B3/02B08B1/02B08B3/10B08B3/14B08B13/00H01L21/67F26B21/00
CPCB08B3/022B08B3/10B08B3/14B08B13/00H01L21/67046H01L21/67034F26B21/003F26B21/001F26B21/004B08B1/12B08B1/20
Inventor 钱诚李刚朱震
Owner 无锡亚电智能装备有限公司
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