PCB copper-clad circuit skeleton contour extraction method based on improved bone spur removal algorithm

Abstract

The invention discloses a PCB copper-clad circuit skeleton contour extraction method based on an improved spur removal algorithm, and the method comprises the steps: searching eight neighborhoods of a pixel point, recording the pixel point according with a cross point principle as a cross point, and putting the cross point into a set Cross; setting the pixel value at the acquired cross point Cross from 1 to 0, putting all separated branch skeletons into a set Branchs, selecting a skeleton of which the Length feature is greater than Length from the skeleton set Branchs, and putting the selected skeleton into a set Trunk_Skeletion; selecting a trunk Trunk0 in the Trunk_Skeletion, calculating the tangential direction T1 of an end point of the trunk Trunk0, setting Cross0 corresponding to the end point from 0 to 1, traversing the Branchs, calculating the tangential direction of a branch near the end point, and if the tangential direction and the T1 form an angle of 180 degrees, merging the branch to obtain a new trunk Trunk0; traversing elements in the Trunk_Skeletion, repeating the operation in the step S3, and finally obtaining a plurality of trunk skeleton lines Trunk0, Trunk1, Trunk2...; S4, combining the Trunk 0, the Trunk 1, the Trunk 2 and the like obtained in the step S4, and obtaining the whole main skeleton Main_Skeletion. According to the extraction method, the outline of the PCB circuit skeleton can be effectively extracted.

Description

technical field [0001] The invention relates to the technical field of detection equipment, in particular to a method for extracting the outline of a PCB copper-clad circuit skeleton with an improved bone spur removal algorithm. Background technique [0002] In recent years, with the rapid development of my country in the field of microelectronics, it has become the world's largest production and export base of electronic products. With the rapid development of science and technology, 3C electronic devices such as smartphones are constantly being thinned, miniaturized, and intelligentized. In order to achieve the goal of less space, faster speed, and higher performance, the requirements for "light, thin, short, and small" printed circuit boards are constantly increasing; especially with the continuous improvement of the functions of smart electronic terminals such as mobile phones As the number of I / O increases, the number of I / Os will also increase, and the line width and lin...

AI Technical Summary

Problems solved by technology

[0007] The object of the present invention is to provide a method for extracting the skeleton outline of PCB copper-clad circuit with improved bone spur removal algorithm, so as to solve the problem that many small burrs will be generated in the existing method for refining the morphological skeleton proposed in the background technology question

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