Processing method of brittle material

Abstract

The invention discloses a processing method of a brittle material. The processing method of the brittle material comprises the following steps of: cutting a contour line of a preset standard hole and a plurality of split lead groups positioned in the range of the contour line on a processing workpiece through first laser, wherein one end of a split lead of each split lead group is connected with the contour line, and the other end of the split lead of each split lead group extends in the range of the contour line; heating and pre-splitting the contour line on the processing workpiece and the split leads of the split lead groups through second laser; processing a blanking hole in the range of the contour line on the processing workpiece in a non-thermal processing manner, wherein the extending end of the split lead of each split lead group extends into the blanking hole; and splitting along the contour line on the processing workpiece and the split leads of the split lead groups, and forming the standard hole in the processing workpiece. The processing method of the brittle material is high in processing success rate.

Description

technical field [0001] The invention relates to the technical field of processing brittle materials, in particular to a processing method for brittle materials. Background technique [0002] With the development and progress of society, production technology is constantly updated and upgraded, and the processing of holes (such as round holes, special-shaped holes (special-shaped holes include square holes), etc.) on brittle materials (such as glass and other high-hardness brittle materials) is gradually changed from the original The traditional mechanical cutting is transformed into laser cutting, which greatly improves the processing efficiency. [0003] At present, the Chinese patent application number 202110524042.5 discloses a laser processing method for the hole structure of a brittle sheet. The laser processing method first selects the first laser to carve a blanking hole in the brittle sheet, so that the blanking hole in the blanking hole The brittle material is blan...

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Problems solved by technology

[0004] In this laser processing method, the edge of the blanking hole engraved by the first laser has edge chipping (edge ​​chipping means that during the cutting process of the plate, due to the reasons of the plate itself and the influence of the cutting tool and speed, the cutting surface of the plate is not smooth. flat, rollover, burrs, etc.), so the split lead line actually cut by the second laser in the split area does not match the preset split lead line, and the split lead line cannot intersect with the standard hole trajectory line formed by cutting before it Bonding, and because the size of the split area between the standard hole track line and the blanking hole is narrow, the stress is relatively concentrated. When performing laser splitting, it is easy to crack out of the range of the standard hole track line from the split lead, resulting in splits Failure, low success rate of product processing

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