Silicon wafer cutting machine with cutting fluid recycling function

Abstract

The invention relates to the field of cutting machines, in particular to a silicon wafer cutting machine with a cutting fluid recycling function. The silicon wafer cutting machine comprises a flow guide plate for collecting cutting fluid, a flow guide groove is formed in one side of the flow guide plate, a primary filtering mechanism for recycling the cutting fluid is arranged at the outlet end of the flow guide groove, the primary filtering mechanism is used for filtering granular impurities in the cutting fluid, a secondary filtering mechanism for recycling the cutting fluid is arranged below the primary filtering mechanism, the secondary filtering mechanism is used for filtering powdery impurities of the cutting fluid, and the primary filtering mechanism and the secondary filtering mechanism are connected through a quick release mechanism. The cutting fluid flows into a tower barrel from the flow guide plate and the flow guide groove, debris, capable of passing through overflow holes, in the cutting fluid directly falls into a box body, debris which cannot pass through the overflow holes is filtered on spiral blades, and at the moment, primary filtering of the cutting fluid is achieved, namely large-particle debris in the cutting fluid is filtered out.

Description

technical field [0001] The invention relates to the field of cutting machines, in particular to a silicon wafer cutting machine with a cutting fluid recovery function. Background technique [0002] my country's photovoltaic solar technology is in a mature stage. In order to develop pollution-free energy, a large number of silicon wafers are used in the production process of photovoltaic solar energy, and the silicon wafers need to be cut into sheets by a silicon wafer cutting machine. On the other hand, there is a lack of a cutting fluid recovery device, and in the cutting process, silicon wafer cutting fluid is a kind of auxiliary consumable product that must be used in the silicon wafer cutting process, and the cutting fluid cannot be effectively recycled every year, resulting in a large amount of cutting waste. liquid. SUMMARY OF THE INVENTION [0003] In order to make up for the prior art, the present invention proposes a silicon wafer cutting machine with a cutting flu...

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Problems solved by technology

[0002] my country's photovoltaic solar technology is at a mature stage. In order to develop pollution-free energy, a large number of silicon wafers are used in the production process of photovoltaic solar energy, and silicon wafers need to be cut into sheets by a silicon wafer cutting machine. The existing silicon wafer cutting machine equipment In terms of equipment, there is a lack of cutting fluid recovery devices, and in the cutting process, silicon wafer cutting fluid is used as an auxiliary material consumable product that must be used in the silicon wafer cutting process, and the cutting fluid cannot be effectively recycled and reused every year, resulting in a large amount of cutting waste liquid

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