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CSP manufacturing process

A manufacturing process and fluorescent film technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as difficulty in controlling the shape and dosage of fluorescent glue, difficulty in ensuring the quality of LEDs in chip-level packaging, and difficulty in controlling the uniformity of thickness of fluorescent glue. , to avoid deformation, avoid damage to electrodes, and achieve good stability

Pending Publication Date: 2021-11-26
HONGLI ZHIHUI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this process is simple, it is difficult to control the shape and amount of the fluorescent glue and the thickness uniformity of the fluorescent glue everywhere because the fluorescent glue has a certain fluidity when packaging the fluorescent glue. Difficult to guarantee quality

Method used

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  • CSP manufacturing process
  • CSP manufacturing process

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the accompanying drawings of the description.

[0020] A CSP, including a fluorescent film support and a flip-chip LED chip 4 combined with a fluorescent film support 1, the fluorescent film support 1 includes a top light-emitting surface and four side light-emitting surfaces, and a crystal-bonding cavity 2 is formed in the fluorescent film support , the volume of the solid crystal cavity 2 is greater than the volume of the flip-chip LED chip 4, a gap is provided between the flip-chip LED chip 4 and the inner surface of the fluorescent film support 1 and is filled with glue, and the flip-chip LED chip 4 passes through the glue and the fluorescent film When the bracket 1 is combined, since the glue is transparent glue, and the gap between the flip-chip LED chip 4 and the fluorescent film bracket 1 is uniform, it is ensured that the overall light output of the CSP is uniform.

[0021] Such as figur...

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Abstract

A CSP manufacturing process comprises the following steps: (1) forming a fluorescent film support with five light-emitting faces through a mold, and forming a solid crystal cavity in the fluorescent film support; and (2) inversely placing an inverted LED chip into the solid crystal cavity of the dried fluorescent film bracket, and combining the LED chip with the fluorescent film bracket by using glue. According to the method, the fluorescent film support is formed by injection molding through a mold, and after the fluorescent film support is completely dried, reverse die bonding is carried out through glue, so that damage to an electrode can be avoided, and deformation caused by the fact that the fluorescent film support is not cured is also avoided; and in addition, the package of the CSP is effectively realized by combining injection molding, electrical gluing and die bonding processes, the process is simple, and the stability is good.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a CSP manufacturing process. Background technique [0002] The existing chip-level packaged LEDs usually emit light from five sides, that is, the top surface and four sides of the LED can emit light. The packaging process of this kind of LED is relatively simple. The specific process is: first lay a fixed film on the carrier , and then fix the LED chip on the fixing film, and then encapsulate the fluorescent glue on the LED chip. The glue is cut, and finally the support plate and the fixed membrane are separated. Although this process is simple, it is difficult to control the shape and amount of the fluorescent glue and the thickness uniformity of the fluorescent glue everywhere because the fluorescent glue has a certain fluidity when packaging the fluorescent glue. Quality cannot be guaranteed. Contents of the invention [0003] The technical problem to be solved by the present inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
CPCH01L33/483H01L33/505H01L33/507H01L2933/0033H01L2933/0041
Inventor 刘萍萍尹键林德顺翁平杨永发李国平
Owner HONGLI ZHIHUI GRP CO LTD
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