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Full-automatic gluing and splicing device for instrument processing

A technology of instrumentation and splicing devices, which is applied in the direction of material gluing, spraying devices, connecting components, etc., can solve the problems of reduced processing efficiency, difficult gluing operation of splicing devices, and difficulty in ensuring installation quality, so as to achieve the effect of improving accuracy

Inactive Publication Date: 2021-11-23
于隆山
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the manufacturing process of instruments and meters, the instrument equipment needs to be spliced ​​into the instrument installation box to complete the installation of the entire equipment. Most of the existing operations are spliced ​​manually, resulting in a large workload for the staff. The work efficiency is low, and it is difficult to guarantee the installation quality by manual operation;
[0003] Moreover, some existing splicing devices usually require manual loading and unloading, which is not smart enough, which increases the workload of workers and reduces processing efficiency. Moreover, the existing splicing devices are difficult to glue, and it is difficult to ensure a single blanking. The ground space is large, and the cost is high, which increases the cost of space and equipment

Method used

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  • Full-automatic gluing and splicing device for instrument processing
  • Full-automatic gluing and splicing device for instrument processing
  • Full-automatic gluing and splicing device for instrument processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Example 1: Please refer to Figure 1-2 , a fully automatic gluing and splicing device for instrumentation processing, including a mounting frame 1, a transmission mechanism 2 is symmetrically installed on both sides of the mounting frame 1, and a feeding channel 3 is installed on the mounting frame 1 inside the transmission mechanism 2, and the feeding channel 3 A feeding mechanism 4 is installed on the top, and a discharge channel 5 is connected to the bottom of the feeding channel 3. A glue spraying mechanism 6 is installed on the outside of the discharge channel 5, and a pushing mechanism 7 is installed on the inside of the discharging channel 5. The pushing mechanism 7 includes a negative The pressure block 701, the negative pressure block 701 and the discharge channel 5 fit each other, the front side of the negative pressure block 701 is evenly connected with the suction cup 702, and the back side of the negative pressure block 701 is connected with the drive bar 70...

Embodiment 2

[0035] Example 2: Please refer to Figure 1-3 , a fully automatic gluing and splicing device for instrumentation processing, including a mounting frame 1, a transmission mechanism 2 is symmetrically installed on both sides of the mounting frame 1, and a feeding channel 3 is installed on the mounting frame 1 inside the transmission mechanism 2, and the feeding channel 3 A feeding mechanism 4 is installed on the top, and a discharge channel 5 is connected to the bottom of the feeding channel 3. A glue spraying mechanism 6 is installed on the outside of the discharge channel 5, and a pushing mechanism 7 is installed on the inside of the discharging channel 5. The pushing mechanism 7 includes a negative The pressure block 701, the negative pressure block 701 and the discharge channel 5 fit each other, the front side of the negative pressure block 701 is evenly connected with the suction cup 702, and the back side of the negative pressure block 701 is connected with the drive bar 70...

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Abstract

The invention relates to the technical field of intelligent manufacturing, and discloses a full-automatic gluing and splicing device for instrument processing. The full-automatic gluing and splicing device comprises a mounting frame. Conveying mechanisms are symmetrically mounted on the two sides of the mounting frame, feeding channels are mounted at the positions, on the inner sides of the conveying mechanisms, of the mounting frame, feeding mechanisms are mounted on the feeding channels, discharging channels are communicated with the lower portions of the feeding channels, glue spraying mechanisms are installed on the outer sides of the discharging channels, and pushing mechanisms are installed on the inner sides of the discharging channels. Each pushing mechanism comprises a negative pressure block, wherein the negative pressure block is matched with the corresponding discharging channel, suction cups are evenly connected to the front side of the negative pressure block, a driving strip and a negative pressure connecting opening are connected to the rear side of the negative pressure block, the negative pressure connecting opening is connected with a negative pressure mechanism, and the driving strip is connected with a driving mechanism. The arranged negative pressure mechanisms can automatically suck and clamp instrument equipment, in cooperation with the pushing mechanisms and the glue spraying mechanisms, the instrument equipment can be automatically glued and spliced, the machining efficiency is effectively improved, and the full-automatic gluing and splicing device is efficient, intelligent and high in practicability.

Description

technical field [0001] The invention relates to the technical field of intelligent manufacturing, in particular to a fully automatic gluing and splicing device for instrumentation processing. Background technique [0002] In the manufacturing process of instruments and meters, the instrument equipment needs to be spliced ​​into the instrument installation box to complete the installation of the entire equipment. Most of the existing operations are spliced ​​manually, resulting in a large workload for the staff. The work efficiency is low, and it is difficult to guarantee the installation quality by manual operation; [0003] Moreover, some existing splicing devices usually require manual loading and unloading, which is not smart enough, which increases the workload of workers and reduces processing efficiency. Moreover, the existing splicing devices are difficult to glue, and it is difficult to ensure a single blanking. The ground space is large, and the cost is high, which...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G15/58B65G47/91B65G47/74B05B13/02B05B12/02F16B11/00
CPCB65G15/58B65G47/91B65G47/74B05B13/0221B05B12/02F16B11/006
Inventor 于隆山
Owner 于隆山
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