Heating device, plasma degumming machine and plasma degumming heating method

Abstract

The invention provides a heating device, a plasma degumming machine and a plasma degumming heating method. The heating device comprises a heating disc and a control circuit, a heat conduction disc is erected on the top of the heating disc, and heat conduction assemblies are evenly arranged on the heating disc; and the bottom ends of the heat conduction assemblies are connected with a driving part which drives the heat conduction assembly to move up and down in a reciprocating mode in the axial direction of the heating disc so as to make contact with or be away from the heat conduction disc, thermistors corresponding to the heat conduction assemblies are arranged at the bottom of the heat conduction disc, and the thermistor sand the driving part are both connected with the control circuit. According to the heating device, the temperature of each area of the heat conduction disc can be controlled to be uniform and stable, meanwhile, it can be guaranteed that the overall temperature of the heat conduction disc can be increased and decreased according to an expected temperature curve, and then the heating effect on the wafer is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of plasma degumming machines, and in particular relates to a heating device, a plasma degumming machine and a plasma degumming heating method. Background technique [0002] The manufacturing process of semiconductor devices includes film deposition (Film Depo), exposure (Photo), etching (Etch), photoresist removal (PR Strip) and wet cleaning (Wet clean). Wherein, the photoresist removal is performed on a plasma asher. [0003] In the prior art, the Chinese utility model patent document whose publication number is CN211017022U discloses a heating plate of a plasma degumming machine, which solves the problem that the existing commonly used heating plates are flat and grooved. The disk is in direct contact with the back of the wafer, which causes the wafer to be heated too quickly, which makes the uniformity of etching photoresist poor. The surface of the grooved heating disk has multiple grooves, and the wafe...

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Problems solved by technology

[0003] In the prior art, the Chinese utility model patent document whose publication number is CN211017022U discloses a heating plate of a plasma degumming machine, which solves the problem that the existing commonly used heating plates are flat and grooved. The disk is in direct contact with the back of the wafer, which causes the wafer to be heated too quickly, which makes the uniformity of etching photoresist poor. The surface of the grooved heating disk has multiple grooves, and the wafer will break due to thermal stress. Especially the problem that the curved wafer is more likely to break, which includes the disc body, the inner side of the disc body is provided with a heating tank, and the heating layer is located under the heating tank in the disc body, and four sets of support rods are fixedly installed in the heating tank , the upper end of the support rod is fixedly installed with a support heat conduction block, a wafer is placed in the heating tank, and the wafer is movably connected with the support heat conduction block, and a heat preservation cover is fixedly installed on the plate above the heating tank

[0004] However, in the above-mentioned prior art, heating is carried out through the heating layer, and the wafer is heated after the heat enters the heating tank. This heating method cannot locally regulate the temperature inside the heating tank, and it is very easy to cause local heating during the initial heating process. There is a phenomenon of uneven heating such as the difference between the temperature and the overall temperature. If the wafer is heated in this way, the wafer is easy to be heated unevenly and cause cracks.

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