Insertion type copper block heat conduction technology

Abstract

The invention discloses an insertion type copper block heat conduction technology which comprises the following steps of S1, selecting an insertable copper-based block and a PCB, arranging the elastic sheet protruding structures at the two sides of an opening of the copper-based block, and reserving a step area on the surface of the PCB in advance; S2, respectively fixing the PCB at the two sides of the copper-based block, and enabling the PCB to correspond to the two elastic sheet protruding structures; externally extruding through a conical jig so as to insert the conical jig into the copper-based block, and matching the two elastic piece protruding structures with the corresponding step areas; and S3, continuously inserting the conical jig and matching the conical jig with a conical hole of the copper-based block, so that the copper-based block is firmly connected with the side wall of the PCB. Compared with an existing copper block implanting technology, the insertion type copper block heat conduction technology is more concise, the operation efficiency is higher, the predictability and the expression degree of product performance and reliability risks are higher, on the whole, the problems of application scenes can be more effectively solved, and the quick breaking of the production cycle and the optimization of the overall cost are combined.

Description

Technical field [0001] The present invention relates to a thermally conductive technique, and more particularly to an inserted copper block thermally conductive technology, which belongs to the technical field of copper block heat conductance. Background technique [0002] The effect of thermal management for the overall performance, reliability and cost of the project is obvious and huge. As one of the main technologies of thermal management, copper block heat dissipation technology is more common. In the actual operation, it is also very high for process control requirements and performance verification requirements for the PCB board. How to efficiently, accurate, achieve best thermal management at the lowest total cost, a great test for PCB manufacturers. [0003] However, there is still a defect and lack of prior art: [0004] Such as direct compression technology, crimping technology, etc. The fluid control control during the pressing process is very accurate. For some appli...

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Problems solved by technology

[0004] Such as direct lamination technology, crimping technology, etc. On the whole, the current process ideas are relatively simple, the process is complicated and difficult to control, and there are also some reliability risks: the pre-cutting of lamination materials by direct lamination technology, The glue flow control during the lamination process must be very precise. For some application scenarios that require high surface flatness, the consistency control of the copper block area is almost harsh, which directly affects the yield rate and overall cost of the final product.

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