Control method for improving warping of aluminum-based mixed compression structure laminated board and PCB

Abstract

The invention discloses a control method for improving warping of an aluminum-based mixed compression structure laminated board, which comprises the following steps of: optimizing a laminated structure to ensure that a thickness ratio of an aluminum-based core board dielectric layer to a core board dielectric layer in an inner core board is more than or equal to 10:1; manufacturing the inner-layer core plate; manufacturing an aluminum-based component, namely, after cutting the aluminum-based component, carrying out hot pressing on the aluminum-based component once in advance; pressing, namely pressing the inner-layer core plate and an aluminum base together by adopting a vacuum laminating machine; conducting plate warping leveling treatment, specifically, after pressing is conducted, conducting leveling treatment by a plate warping leveling machine; carrying out X-Ray targeting; ceramic grinding; manufacturing an outer-layer circuit; performing acid etching; carrying out resistance welding; forming a character; performing gold immersion; carrying out e-T testing; forming CNC appearance; and inspecting a finished product. The aluminum base and the inner core plate with preset thickness are selected, so that the whole PCB is lighter and thinner, the warpage of the PCB is reduced, the high-pressure-resistant requirement of the PCB can be met, hot pressing is performed once by using a high-temperature press (200 DEG C) in advance, the thermal stability of the aluminum base is improved, the hot-pressing expansion and shrinkage change of the aluminum base is reduced, and the high-flatness requirement of a customer on a product is met.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a control method and a PCB board for improving the warpage of aluminum-based mixed-press structure laminated boards. Background technique [0002] At present, automotive power module products are mainly based on thick copper core board laminated aluminum base structure, relying on surface copper, hole copper, high thermal conductivity bonding sheet and metal aluminum base to achieve rapid heat conduction of the product, because the metal aluminum base and copper core board are When two materials with different physical properties are pressed together at high temperature, their expansion and contraction changes are inconsistent, and board warpage is easily exceeded (warping degree ≥ 1.5%), which affects the flatness of the product and has a potential impact on the quality of the customer's subsequent placement. Contents of the invention [0003] Based on this, it is necessary...

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Problems solved by technology

[0002] At present, automotive power module products are mainly based on thick copper core board laminated aluminum base structure, relying on surface copper, hole copper, high thermal conductivity bonding sheet and metal aluminum base to achieve rapid heat conduction of the product, because the metal aluminum base and copper core board are Two materials with different physical properties, when pressed at high temperature, their expansion and contraction changes are inconsistent, and board warpage is easily exceeded (warping degree ≥ 1.5%), which affects product flatness and has a potential impact on customer follow-up placement quality

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