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Solid precursor source sublimation device and method for semiconductor processing

A sublimation device and semiconductor technology, applied in the directions of sublimation, separation methods, chemical instruments and methods, etc., can solve the problems of affecting the utilization rate of precursor sources, increasing the frequency of equipment shutdown, and unfavorable vapor deposition, so as to reduce the frequency of shutdown and bottle replacement. , Provide the effect of life cycle and stable volatilization area

Active Publication Date: 2021-10-22
ZHEJIANG DAUGHTER VESSEL SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compaction and low-resistance channels will seriously affect the utilization rate of the solid precursor source in the source bottle, increasing the frequency of equipment shutdown, which is very unfavorable for vapor deposition

Method used

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  • Solid precursor source sublimation device and method for semiconductor processing
  • Solid precursor source sublimation device and method for semiconductor processing
  • Solid precursor source sublimation device and method for semiconductor processing

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Embodiment 1: A kind of solid precursor source sublimation device for semiconductor processing (see attached figure 1 to attach image 3 ), including a storage box 1, a tray 2 installed in the storage box, an electric heating temperature control plate 3 installed at the bottom of the tray, a number of storage tanks 4 for loading solid-state precursor sources are densely covered on the tray, and several storage tanks are arranged in the storage box The upper and lower trays are arranged at intervals, the gap between the upper and lower adjacent trays forms a ventilation cavity, the uppermost tray and the top of the storage box form a ventilation cavity, and a ventilation groove 9 is provided on one side of the tray; the ventilation on the upper and lower adjacent trays One of the slots is on the left side of the tray, and the other is on the right side of the other tray. The ventilation slots connect all the ventilation chambers together to form a serpentine ventilation ...

Embodiment 2

[0040] Embodiment 2: A kind of solid precursor source sublimation device for semiconductor processing (see attached Figure 4 , attached Figure 5 ), its structure is similar to that of Embodiment 1, the main difference is that in this embodiment, an adjustment plate 16 is arranged on the upper part of the longitudinal baffle plate, the adjustment plate can be rotated, and a push-pull rod 17 is installed in the storage box, and the adjustment plates are all connected with the push-pull rod. The movement of the push-pull rod drives the adjustment plate to rotate, and one side of the adjustment plate and the material storage tank are equipped with a plurality of driving rods 18 correspondingly, the lower end of the driving rod is placed in the material storage tank, and the piston cylinder 19 is installed outside the storage box. Magnetic block 20 is installed, and the slide block 21 that can attract each other with magnetic block is installed in the storage box, slides and can ...

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Abstract

The invention discloses a solid precursor source sublimation device and a solid precursor source sublimation method for semiconductor processing, and aims to overcome the defects of unstable volatilization and sublimation of a solid precursor source and low utilization rate of the solid precursor source. The solid precursor source sublimation device comprises a storage box, a plurality of trays installed in the storage box and electric heating temperature control plates installed at the bottoms of the trays, a plurality of material storage grooves used for loading solid precursor sources are densely distributed on the trays, a snakelike ventilation flow channel is formed in the storage box, and a carrier gas inlet and a mixed steam outlet are formed in the storage box. Two ends of the ventilation flow channel respectively communicate with the carrier gas inlet and the mixed steam outlet. The electric heating type solid precursor source storage and sublimation device can provide uniform and stable heat energy for volatilization and sublimation of a solid precursor source, avoids formation of a low-resistance channel phenomenon, and can still utilize some solid precursor sources which are easy to harden and have certain vapor pressure; and the utilization rate of the solid precursor source is improved while the solid precursor source steam with stable concentration is provided.

Description

technical field [0001] The invention relates to a semiconductor processing technology, more specifically, it relates to a solid precursor source sublimation device and method for semiconductor processing. Background technique [0002] Precursors are the main raw materials for semiconductor thin film deposition processes. IC precursors can be summarized as: used in semiconductor manufacturing processes, carrying target elements, in gaseous or volatile liquid state, with chemical and thermal stability, and a class of substances with corresponding reactivity or physical properties. In the semiconductor manufacturing process including thin film, lithography, interconnection, doping technology, etc., the precursor is mainly used in vapor deposition (including physical deposition PVD, chemical vapor deposition CVD and atomic vapor deposition ALD) to form semiconductor manufacturing requirements various thin film layers. In addition, the precursor can also be used for semiconduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/448B01D7/00
CPCC23C16/4481B01D7/00
Inventor 谈益强朱梦玉薛剑
Owner ZHEJIANG DAUGHTER VESSEL SCI & TECH CO LTD
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