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Control system and method of semiconductor manufacturing equipment

A technology for manufacturing equipment and control systems, applied in semiconductor/solid-state device manufacturing, general control systems, control/regulation systems, etc., can solve problems such as defective products and waste of process time, and achieve the effect of minimizing human errors

Active Publication Date: 2021-10-12
NAN YA TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, manual inspection and adjustment of etching tools using techniques such as optical critical-dimension mapping often results in lost processing time and defective products due to human error. )

Method used

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  • Control system and method of semiconductor manufacturing equipment
  • Control system and method of semiconductor manufacturing equipment
  • Control system and method of semiconductor manufacturing equipment

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Embodiment Construction

[0134] The following description of the disclosure, accompanied by the accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure to which, however, the disclosure is not limited. In addition, the following embodiments can be properly integrated to complete another embodiment.

[0135]It should be understood that although the terms "first", "second", "third" etc. may be used herein to describe various elements, components, regions, layers and / or sections, These elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, a "first element", "component", "region", "layer" or "section" discussed below may be referred to as a second means , component, region, layer or section without departing from the teachings herei...

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Abstract

The invention provides a control system and method of semiconductor manufacturing equipment. The control system is provided with a sensor, a sensor interface and an analysis unit. The sensor provides a sensing signal. The sensor interface receives the sensing signal and generates an input signal for a database server. A front-end subsystem receives the input signal from the database server and executes a comparison program to generate a data signal. A computing subsystem executes an artificial intelligence analysis program according to the data signal to generate an optimized parameter setting and a simulation result map. An information and adjustment subsystem generates an alarm signal and a feedback signal according to the optimization parameter setting and the simulation result map, and transmits the alarm signal to a user of the semiconductor manufacturing equipment.

Description

technical field [0001] This disclosure claims priority and benefit to US Formal Application Serial No. 16 / 825,889, filed March 20, 2020, the contents of which are hereby incorporated by reference in their entirety. Background technique [0002] The semiconductor industry has experienced rapid growth due to improvements in integration density. Semiconductor manufacturing equipment such as etching tools generally need to continuously adjust process parameters in order to optimize etching uniformity. However, manual inspection and adjustment of etching tools using techniques such as optical critical-dimension mapping often results in lost processing time and defective products due to human error. ). Accordingly, the equipment control system and method need to effectively provide optimized process parameters for equipment adjustment, simulation prediction results, and early warnings. [0003] The above "prior art" description is only to provide background technology, and does...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67276H01L21/67253G05B13/048G05B13/042G05B2219/45031Y02P90/02G05B13/0265
Inventor 锺政廷林维斌黄庆茂
Owner NAN YA TECH
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