Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mode converter and manufacturing method for mode converter

A mode converter and wave mode technology, which is applied in the directions of waveguide-type devices, waveguides, electrical components, etc., can solve the problems of increased man-hours in the manufacturing method of mode converters.

Inactive Publication Date: 2021-09-24
THE FUJIKURA CABLE WORKS LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is because when the diameter DT and the diameter DB are different from each other, it is necessary to separate the process of forming a through hole in the substrate from the process of forming a blind hole in the substrate, and the man-hours of the manufacturing method of the mode converter increase.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mode converter and manufacturing method for mode converter
  • Mode converter and manufacturing method for mode converter
  • Mode converter and manufacturing method for mode converter

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach 〕

[0026] Hereinafter, reference Figure 1 ~ 3 The mode converter according to the first embodiment of the present invention will be described. figure 1 (A) is a top view of the mode converter 10 according to the present embodiment. figure 1 (B) is an enlarged cross-sectional viewmap in the vicinity of the blind hole BV provided by the mode converter 10. figure 2 (A) is a top view and a side view of a blind hole BV. figure 2 (B) is a top view and a side view of a blind hole BVA as a first modification of the blind hole BV. image 3 (A) is a top view and a side view of a blind hole BVB as a second modification of the blind hole BV. image 3 (B) is a top view and a side view of a blind hole BVC as a third modification of the blind hole BV.

[0027]

[0028] like figure 1 (A) and figure 1 (B), the mode converter 10 includes a post wall waveguide PW, a microstrip line MS, and a blind hole BV.

[0029] (Column wall waveguide PW)

[0030] like figure 1 (B), the column wall waveguide PW inclu...

no. 2 approach 〕

[0065] Refer Figure 4 The manufacturing method M10 of the second embodiment of the present invention is described, and the method M10 of the above-described mode converter 10 will be described. In the present embodiment, the manufacturing method M10 will be described as an example of the blind hole BV, but according to each blind hole BVA, BVB, BVC can also be manufactured in the same manner. Further, in order to facilitate explanation, the description related to the blind hole BV is not repeated.

[0066] like Figure 4 As shown, the manufacturing method M10 includes: a step S11 forming a plurality of through holes and non-through holes; and forming the conductor layers 12, 13, through holes 14i, and blind holes S12. Each of the steps S11 and the step S12 is an example of the first step and the second step described in the scope of the claim. Further, in the present embodiment, in the step S12, the case where the conductor layers 12, 13, through holes 14i, and blind hole BV are fo...

no. 1 example

[0083] Will have figure 2 The embodiment group of the mode converter 10 of the blind hole BV shown in (a) is set to the first embodiment of the present invention. Figure 5 It is a graph showing the reflection characteristics of the mode converter 10 of the first embodiment.

[0084] In the first embodiment, the thickness of the substrate 11 is also set to 700 μm, and the width W1 of the column wall waveguide PW is set to 4 mm, and the width W2 of the microstrip wire 21 is set to 200 μm. On this basis, the height Hb of the cylinder C1 to C4 of the fitted blind hole BV is 550 μm or more and 650 μm or less, 12.5 μm (reference Figure 5 ).

[0085] Refer Figure 5 It can be seen that the mode converter 10 of the first embodiment is shown in the case where the height Hb is 587.5 μm or more and 637.5 μm or less, and in the case of HB = 625 μm, the best reflection is shown within the operating frequency band. characteristic. In particular, it is understood that the mode converter 10 as an ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The purpose of the present invention is to simplify a manufacturing method for a mode converter. A mode converter (10) is provided with a post wall waveguide (PW), a microstrip line (MS), and a blind via (BV) that converts the waveguide mode of the post wall waveguide (PW) and the waveguide mode of the microstrip line (MS), the blind via (BV) having a shape that is approximated by merging a plurality of columns (C1-C4). The diameter of each of the plurality of columns (C1-C4) is the same as the diameter of a through via 14i.

Description

Technical field [0001] The present invention relates to a method converter and a mode converter for converting the guiding mode of the column wall waveguide with the waveform pattern of the microstrip line and the mode converter. Background technique [0002] In Non-Patent Document 1, a mode converter that converts the guiding mode of the column wall waveguide with the microstrip line is converted to each other. [0003] In these mode converters, the column wall waveguide includes a substrate made of dielectric (e.g., quartz); a pair of conductor layers formed on a pair of main surfaces of the substrate; and a column wall formed on the inside of the substrate. A pair of conductor layers functions as a pair of width walls sandwich from the two directions (e.g., up and down), the column wall as a pair of narrow walls surrounded by the region (e.g., front and rear left and right directions) and A pair of short walls functions. The column wall is constructed of a plurality of through...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01P5/107H01P3/12
CPCH01P5/107H01P3/121
Inventor 上道雄介
Owner THE FUJIKURA CABLE WORKS LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products