Modeling of an igct water-cooled radiator and its junction temperature calculation method
A water-cooled radiator and calculation method technology, applied in the direction of calculation, computer-aided design, design optimization/simulation, etc., can solve the problems of inaccurate prediction results in practical applications, failure to consider the influence of temperature distribution, and prediction of junction temperature. The effect of easy software programming, accurate calculation and accurate calculation results
Active Publication Date: 2022-04-15
TIANJIN RES INST OF ELECTRIC SCI
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[0004] The purpose of the present invention is to overcome the deficiencies of the prior art, propose a IGCT water-cooled radiator modeling and its junction temperature calculation method, solve the existing IGCT module junction temperature calculation method that does not consider the multi-stage power-heating coupling in the water cooling system The influence of the temperature distribution makes the prediction of the junction temperature deviate from the actual application and the prediction result is inaccurate
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[0041] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0042] A method for modeling an IGCT water-cooled radiator and calculating its junction temperature comprises the following steps:
[0043] Step 1. Establish a radiator temperature rise thermal resistance model, and use the temperature rise thermal resistance model to calculate radiator thermal resistance parameters of a single IGCT water-cooled radiator.
[0044] The IGCT water-cooled radiator is designed for double-sided heat dissipation. The front and back sides of the interior are made of round planes of stainless steel and cast aluminum alloy. The cooling water first enters one stainless steel water pipe, and then flows from the center to the other stainless steel water pipe. Therefore, the internal water circuit is serially radiated. The heat dissipation performance of the upper and lower sides of the device is different. For example, in practical appl...
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The invention relates to a modeling method of IGCT water-cooled radiator and its junction temperature calculation method. Its technical characteristics are: the present invention establishes a model of n-level series crimped water-cooled radiators of IGCT water-cooled system, and calculates according to a single IGCT water-cooled radiator Results The n-level series crimped water-cooled radiator model of the IGCT water-cooling system was calculated, so as to obtain the accurate junction temperature of the IGCT power device. When the present invention calculates a single IGCT water-cooled radiator, by analyzing the influence of the temperature difference between the inlet and outlet water and the waterway difference, the thermal coupling effect on the front and back sides of the water-cooled radiator is considered, the thermal coupling model is simplified and abstracted, and the model of the water-cooled radiator is improved. Accuracy; The n-level series connection crimping water-cooling radiator model of IGCT water-cooling system is set up for n-level series heat dissipation coupling factors, and a general calculation method is obtained. The present invention can accurately calculate the power device junction temperature, and can be used for power device temperature l Accurate estimation, easy to realize by software programming.
Description
technical field [0001] The invention belongs to the field of water-cooled power electronic equipment, in particular to a modeling method of an IGCT water-cooled radiator and a junction temperature calculation method thereof. Background technique [0002] The core components in the medium voltage converter are power modules composed of IGCT transistors and fast recovery diodes. They are also the main source of heat loss in the system. If the accumulated heat exceeds the maximum allowable junction temperature, it will seriously affect the performance of the power module and system reliability. Therefore, it is very important to study the junction temperature calculation and protection control of IGCT devices. In addition, how to effectively determine the thermal resistance of the water cooling device is also a key issue in the calculation of IGCT junction temperature. [0003] Common methods to solve the above problems are heat source temperature measurement or simulation mod...
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IPC IPC(8): G06F30/20G06F119/08
CPCG06F30/20G06F2119/08
Inventor 田凯俞智斌楚子林王自满姜一达李楠杨敬然
Owner TIANJIN RES INST OF ELECTRIC SCI
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