Optoelectronic semiconductor device

Abstract

The invention discloses an optoelectronic semiconductor device, which structurally comprises a blocking and sealing device, a packaging cavity, a semiconductor device body and a pin. According to the invention, when the optoelectronic semiconductor device is used, a worker manually opens four attaching blocking pieces outwards, a tension piece is opened accordingly, a pin vertically and downwards extends into an interface, the worker slowly loosens the attaching blocking pieces, an elastic rod can generate resilience force under the condition that the elastic rod is not stressed, the attaching blocking pieces can be pushed inwards under the resilience inertia of the elastic rod, the four attaching blocking pieces can retract inwards at the same time to be attached to the pin, the tension piece can also be attached to the side wall of the pin along with retraction of the attaching blocking pieces, and air outside the pin is blocked through mutual cooperation of the attaching blocking pieces and the tension piece, so that the use stability of the optoelectronic semiconductor device is ensured.

Description

Technical field [0001] The present invention relates to the field of optoelectronics, particularly relates to an optoelectronic semiconductor device. Background technique [0002] With the rapid development of information technology, the optoelectronic semiconductor device is widely used, the design principle of the optoelectronic semiconductor device is based on the external field changes the propagation mode of the guided light, the optoelectronic semiconductor device is broadly divided into two categories: one is the electrical energy into light energy a light emitting device; one is the light energy into electrical energy photosensitive component, a barrier for blocking the outside air through the element, during use of the optoelectronic semiconductor devices, for improvement: [0003] During use of the optoelectronic semiconductor component, the optoelectronic semiconductor device needs to be packaged, during the packaging process, due to the need for lead-out pin, generall...

AI Technical Summary

Problems solved by technology

[0003] When using optoelectronic semiconductor devices, it is necessary to package the optoelectronic semiconductor devices. During the packaging process, since the pins need to be led out, the interface of the general pins will be larger than the area of ​​the pins, so that there will be a certain amount of direct contact between the pins and the interface. The gap between the two will cause the external air to flow into the package of the optoelectronic semiconductor device through the gap between the two, and the impurities in the air will adhere to the semiconductor device, which will directly affect the stability of the optoelectronic semiconductor device and cause optoelectronics. Short circuit phenomenon occurs when semiconductor devices are in use

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