A hot melt adhesive sample viscosity measuring device

A viscosity measurement and hot melt adhesive technology, which is applied in the direction of measuring devices, instruments, scientific instruments, etc., can solve the problems of complicated steps, low efficiency of hot melt adhesive detection, and a lot of time spent

Active Publication Date: 2022-03-01
靖江市金马胶粘制品制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Due to the complicated steps in the whole processing process of hot melt adhesive, more time is spent in the hot melt adhesive detection process, resulting in low efficiency of staff for hot melt adhesive detection

Method used

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  • A hot melt adhesive sample viscosity measuring device
  • A hot melt adhesive sample viscosity measuring device
  • A hot melt adhesive sample viscosity measuring device

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Experimental program
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Embodiment Construction

[0026] The following is attached Figure 1-5 The application is described in further detail.

[0027] The embodiment of the present application discloses a device for measuring the viscosity of a hot melt adhesive sample. refer to figure 1 , The hot melt adhesive sample viscosity measuring device includes a test object delivery device 1, the test object delivery device 1 is used to hold the test ball 2, and a sample delivery device used in conjunction with the test object delivery device 1 to transport the sample body 5 device6.

[0028] refer to figure 2 The test object delivery device 1 includes a first frame 3 and an auxiliary positioning device 4 arranged on the first frame 3.

[0029] The first frame 3 includes a base 31, a placement plate 32, a material delivery frame 33, and a feed hopper 34; the base 31 is placed on the ground, and is a horizontal cuboid; the placement plate 32 is fixedly connected to the upper end surface of the base 31, and is horizontal Settin...

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Abstract

The present application relates to a hot-melt adhesive sample viscosity measuring device, which includes a first frame, on which a horizontally placed placing plate is installed, and a material conveying frame is installed on the upper end of the placing plate. A plurality of test balls are placed in the material conveying frame, and the diameters of the plurality of test balls are the same, and the quality is different; one side of the first frame is provided with a sample conveying mechanism for conveying the sample body to the test ball. device, the first rack is equipped with a pressing component that presses the sample body toward the test ball side so that the sample body contacts the test ball, and the material delivery frame is formed with a discharge that runs through the placement plate. The discharge groove is located on the side of the pressing assembly away from the input direction of the test ball. The application has the effects of shorter hot melt adhesive detection time and higher hot melt adhesive detection efficiency.

Description

technical field [0001] The present application relates to the field of hot melt adhesive detection, in particular to a hot melt adhesive sample viscosity measuring device. Background technique [0002] At present, hot melt adhesives are mainly composed of four parts, namely: carrier (paraffin, also known as viscosity modifier), tackifying resin (rosin and rosin resin or petroleum resin), matrix (EVA resin or thermoplastic resin) and filler (inorganic things). [0003] Hot melt adhesive is a kind of plastic adhesive, its physical state will change with temperature within a certain temperature range. The product itself is solid, easy to pack, transport, and store. It is solvent-free, non-polluting, non-toxic, and has a simple production process, high bonding strength, and fast curing speed. It is widely used in industrial production and daily life. During the production process of hot melt adhesive, it is necessary to measure its melt viscosity at high temperature, which pla...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N11/00
CPCG01N11/00
Inventor 张新国
Owner 靖江市金马胶粘制品制造有限公司
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