Method for analyzing tin layer thickness of CP leading-out wire for electrolytic capacitor

Abstract

The invention discloses a method for analyzing the tin layer thickness of a CP leading-out wire for an electrolytic capacitor. The method comprises the steps of: firstly, vertically fixing a CP leading-out wire for an electrolytic capacitor, enabling the leading-out wire to be perpendicular to a mold, carrying out the SEM analysis after the leading-out wire is polished, and then carrying out measurement analysis by Image Pro Plus software. The method is simple and convenient to operate. The tin layer thickness information and the distribution state of the leading-out wire for the electrolytic capacitor can be conveniently, rapidly and accurately obtained, the actual structure condition of the tin layer can be comprehensively and visually reflected, the problem that the thickness of only one point can be detected at a time is avoided, and detection points do not need to be replaced for multiple times. The method is suitable for quality control of electrolytic capacitor outgoing line manufacturing departments and electrolytic capacitor production departments, and provides technical support for researching the comprehensive performance of the electrolytic capacitor.

Description

technical field [0001] The invention relates to the technical field of detection and analysis, in particular to an analysis method for the thickness of a tin layer of a CP lead-out wire for an electrolytic capacitor. Background technique [0002] Electrolytic capacitors are important components in the electronics industry. With the rapid development of the electronic industry, the performance and integration of electromechanical products are getting higher and higher, and the requirements for electronic components are also increasing, and higher requirements are also put forward for electrolytic capacitors. The CP lead-out wire for electrolytic capacitors is one of the important structures. The lead-out wire has a three-layer metal structure: the inner layer is the base iron layer, and the diameter is 70% of the diameter of the finished product; the middle layer is copper, and the thickness is 20% of the diameter of the finished product. ; The inner base material and the mi...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the defects and deficiencies that the thickness of the tin layer of the CP lead-out wire for the existing electrolytic capacitor cannot be measured comprehensively and intuitively, and provide an analysis method for the thickness of the tin layer of the CP lead-out wire for the electrolytic capacitor. The CP lead-out wires for capacitors use a scanning electron microscope (SEM) and cooperate with Image Pro Plus analysis to analyze the distribution and thickness of the tin layer on the surface. This can be used as an important means of technical analysis of electrolytic capacitors, and it is helpful for the quality control and improvement of electrolytic capacitors. important meaning

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