Semiconductor chip wafer rod transferring and slitting device

Abstract

Disclosed is a semiconductor chip wafer rod transferring and slitting device. The device comprises: a supporting body, wherein the supporting body comprises a cabinet body, and the two sides of the lower end of the cabinet body are each provided with a pair of adjusting mechanisms; a feeding assembly, arranged at one end of the supporting body and comprising an upward moving mechanism, wherein the upward moving mechanism is provided with a pair of placing mechanisms; a transferring assembly, arranged at the upper end of the supporting body and comprising a translation mechanism, wherein the translation mechanism is provided with a pair of lifting mechanisms, and clamping mechanisms are arranged at the lower ends of the lifting mechanisms; a clamping assembly, arranged at the upper end of the supporting body and comprising a lower clamping component, wherein a downward pressing mechanism is arranged on one side of the lower clamping component, a turnover mechanism is arranged at the upper end of the downward pressing mechanism, and an upper clamping component is installed on the turnover mechanism; and a slitting assembly, arranged at the upper end of the supporting body and comprising a feeding mechanism, wherein the feeding mechanism is provided with a slitting mechanism. According to the device, the cutting operation of a wafer rod is facilitated, the cutting automation degree, the cutting efficiency and the cutting precision of the wafer rod are improved, the automatic transfer of the wafer rod is facilitated, the clamping and positioning of the wafer rod are facilitated, and the cutting quality of a wafer disc is improved.

Description

technical field [0001] The invention relates to the related technical field of chip wafer processing, in particular to a semiconductor chip wafer rod transfer and cutting device. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. [0003] Generally, the common silicon wafer production process includes: silicon extraction and purification, single crystal silicon growth, and wafer molding. Among them, the purification of silicon is the first process, and sandstone raw materials need to be placed in a temperature exceeding 2,000 degrees Celsius In an electric arc furnace with a carbon source, a reduction reaction occurs at a high temperature to obtain metallurgical-grade silicon, and then the pulverized metallurgical-grade silicon i...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the slitting efficiency of the wafer disc is low, and it is inconvenient to carry out the transfer of the wafer during the slitting of the wafer bar, and the transfer is easy to cause damage to the wafer bar, thereby Affecting the quality of the wafer disc and other issues; at the same time, it is inconvenient to clamp the wafer rod during the slitting of the wafer rod, which leads to a decrease in the slitting accuracy, affects the slitting quality, and even increases the scrap rate

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