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Gluing equipment for power amplifier chip production

A power amplifier and gluing technology, which is applied in the cleaning method, coating, chemical instrument and method of tools, etc., can solve the problems of the power amplifier chip being unable to remove dust and reducing the ash feeding rate.

Active Publication Date: 2021-08-06
北京澳丰源科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a kind of gluing equipment for the production of power amplifier chips, to solve the problem that in the prior art, the power amplifier chips cannot be dedusted before installation and gluing, and the power amplifier chips can be minimized during the installation and gluing process. Technical problems of ash rate

Method used

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  • Gluing equipment for power amplifier chip production
  • Gluing equipment for power amplifier chip production
  • Gluing equipment for power amplifier chip production

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Embodiment Construction

[0031] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] Combine below Figure 1 to Figure 11 As shown, the embodiment of the present invention provides a kind of gluing equipment for the production of power amplifier chips, including a dust removal device 1, a chip mounting device 3 and a gluing device 4, and the chip mounting device 3 is arranged on one side of the dust removal device 1 , the gluing device 4 i...

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Abstract

The invention discloses gluing equipment for power amplifier chip production, and belongs to the technical field of power amplifier chip production equipment. The gluing equipment comprises a dust removal device, a chip mounting device and a gluing device. The chip mounting device is arranged on one side of the dust removal device, the gluing device is mounted below the chip mounting device, and the dust removal device comprises a dust removal part, a moving assembly, an air inflation assembly and a replacement assembly; and the moving assembly comprises a base table and a first electric push rod, the first electric push rod is horizontally arranged at the top of the base table, the air inflation assembly is mounted at the output end of the first electric push rod, the replacement assembly is arranged on one side of the air inflation assembly, and the dust removal piece is mounted on the replacement assembly. According to the gluing equipment for power amplifier chip production, dust removal, gluing and mounting operation can be carried out on the chip base and the chip cover plate under the condition that the distance between the chip base and the chip cover plate is very small, and the dust inlet rate during gluing operation can be greatly reduced, so that the yield of a power amplifier chip is improved.

Description

technical field [0001] The invention relates to the technical field of power amplifier chip production equipment, in particular to a glue coating equipment for power amplifier chip production. Background technique [0002] Power amplifier (English name: power amplifier), referred to as "power amplifier", refers to an amplifier that can generate maximum power output to drive a certain load (such as a speaker) under a given distortion rate. The power amplifier plays a pivotal role in the "organization and coordination" of the entire audio system, and to some extent determines whether the entire system can provide good sound quality output. [0003] In the production and processing of the chip in the power amplifier, gluing is an essential process. The power amplifier chip is usually set on the chip base, and then the power amplifier chip is installed by bonding the chip base and the chip cover. Inside the chip base and chip cover, the chip is a relatively precise part product...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C9/10B08B1/00B08B13/00B05C5/02
CPCB05C9/10B08B13/00B05C5/0212B08B1/10
Inventor 孟剑姚建海
Owner 北京澳丰源科技股份有限公司
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