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A kind of LED screen comprehensive encapsulation system and encapsulation method thereof

A packaging system and comprehensive technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as low work efficiency, and achieve the effect of reducing costs and reducing human-assisted participation.

Active Publication Date: 2022-07-22
重庆新视通智能科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The existing LED screen comprehensive packaging method usually uses manual placement of the injection mold on the glue filling table, then puts the LED raw material into the mold cavity of the mold, finally covers the mold cover, and finally pours water into the mold Wrapping the chip and the bracket, this packaging method requires more steps of manual participation, requires continuous manual auxiliary processing, and the work efficiency is relatively low

Method used

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  • A kind of LED screen comprehensive encapsulation system and encapsulation method thereof
  • A kind of LED screen comprehensive encapsulation system and encapsulation method thereof
  • A kind of LED screen comprehensive encapsulation system and encapsulation method thereof

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Embodiment Construction

[0036] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0037] see Figures 1 to 11 , The present invention proposes a technical solution, a comprehensive packaging system for an LED screen, comprising a displacement structure 10, a glue injection table 1 is arranged below the displacement structure 10, and a raw material conveyor 8 is arranged on one side of the glue injection table 1, The LED raw material 6 is placed on the conveyor belt of the raw material conveyor 8, and the top cover...

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Abstract

The invention discloses a comprehensive packaging system for an LED screen and a packaging method thereof, comprising a displacement structure, a glue injection workbench is arranged below the displacement structure, and a raw material conveyor is arranged on one side of the glue injection workbench, so the LED raw materials are placed on the conveyor belt of the raw material conveyor, and a top cover conveyor is arranged behind the plastic injection workbench and on the side close to the LED raw materials, and a plastic injection mold is placed on the conveyor belt of the top cover conveyor. In the top cover, a bracket conveyor is arranged in front of the glue injection workbench and on the side close to the LED raw material. The LED screen comprehensive packaging system and packaging method realizes mechanized automatic feeding without manual continuous feeding operation, effectively reduces the manual assistance and participation links, and one clamping structure can complete three different The grasping and placing of the workpiece does not require the coordinated use of multiple robots, which reduces the cost of use and production.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a comprehensive packaging system for an LED screen and a packaging method thereof. Background technique [0002] LED display is a kind of flat-panel display, which consists of small LED module panels, which are used to display various information such as text, images, and videos. LED electronic display integrates microelectronics technology, computer technology and information processing. It has the advantages of bright colors, wide dynamic range, high brightness, long life, stable and reliable operation. LED displays are widely used in commercial media, cultural performance markets, stadiums, information dissemination, news releases, securities trading, etc., which can meet the needs of different environments. In the process of packaging the LED, it is necessary to pour glue on the chip and the bracket to wrap it, and then bake it for a long time. [0003] The existing LED screen comprehen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/52H01L27/15
CPCH01L33/48H01L33/52H01L27/156H01L2933/0033H01L2933/005
Inventor 孙雪芹
Owner 重庆新视通智能科技有限公司
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