A kind of LED screen comprehensive encapsulation system and encapsulation method thereof

Abstract

The invention discloses a comprehensive packaging system for an LED screen and a packaging method thereof, comprising a displacement structure, a glue injection workbench is arranged below the displacement structure, and a raw material conveyor is arranged on one side of the glue injection workbench, so the LED raw materials are placed on the conveyor belt of the raw material conveyor, and a top cover conveyor is arranged behind the plastic injection workbench and on the side close to the LED raw materials, and a plastic injection mold is placed on the conveyor belt of the top cover conveyor. In the top cover, a bracket conveyor is arranged in front of the glue injection workbench and on the side close to the LED raw material. The LED screen comprehensive packaging system and packaging method realizes mechanized automatic feeding without manual continuous feeding operation, effectively reduces the manual assistance and participation links, and one clamping structure can complete three different The grasping and placing of the workpiece does not require the coordinated use of multiple robots, which reduces the cost of use and production.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a comprehensive packaging system for an LED screen and a packaging method thereof. Background technique [0002] LED display is a kind of flat-panel display, which consists of small LED module panels, which are used to display various information such as text, images, and videos. LED electronic display integrates microelectronics technology, computer technology and information processing. It has the advantages of bright colors, wide dynamic range, high brightness, long life, stable and reliable operation. LED displays are widely used in commercial media, cultural performance markets, stadiums, information dissemination, news releases, securities trading, etc., which can meet the needs of different environments. In the process of packaging the LED, it is necessary to pour glue on the chip and the bracket to wrap it, and then bake it for a long time. [0003] The existing LED screen comprehen...

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Problems solved by technology

[0003] The existing LED screen comprehensive packaging method usually uses manual placement of the injection mold on the glue filling table, then puts the LED raw material into the mold cavity of the mold, finally covers the mold cover, and finally pours water into the mold Wrapping the chip and the bracket, this packaging method requires more steps of manual participation, requires continuous manual auxiliary processing, and the work efficiency is relatively low

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