Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-performance full-duplex communication circuit

A communication circuit and full-duplex technology, applied in the field of communication, can solve problems such as unfavorable signal reception and decoding, and unsatisfactory transmission performance, so as to achieve maximum reception gain, stable reception and transmission signal performance, and improved reception performance.

Pending Publication Date: 2021-07-23
GUANGDONG KUANPU TECH CO LTD
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the transmission performance of high-performance full-duplex communication circuits is not very ideal. During the processing of transmission signals, clutter radiation signals are generated, resulting in interference signals before the signals are transmitted by the antenna, which is not conducive to the subsequent reception and decoding of signals.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-performance full-duplex communication circuit
  • High-performance full-duplex communication circuit
  • High-performance full-duplex communication circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as Figure 1 to Figure 7 As shown, a high-performance full-duplex communication circuit in this embodiment includes a low-frequency processing module, a high-frequency processing module, a signal input port, a signal receiving port, a low-frequency antenna, and a high-frequency antenna; the low-frequency processing module and the high-frequency The processing modules all include a power amplifier circuit, a straight-through filter circuit and a transceiver switch circuit connected in sequence;

[0040] The power amplifying circuit of the low frequency processing module and the power amplifying circuit of the high frequency processing module are respectively connected to the signal input port through a selective filter circuit; The transceiver switch circuit of the frequency band processing module is connected to the high frequency antenna bidirectional signal through a directional coupling circuit; the transceiver switch circuit of the low frequency band processing...

Embodiment 2

[0063] In this embodiment, a high-performance full-duplex communication circuit is illustrated by taking the 30-500M band signal as an example, as Figure 8shown. The low-frequency band processing module processes 30-100M band signals, and the low-frequency band processing module processes 110-500M band signals. In the low-frequency band processing module, the power amplifier circuit is a 30-100M power amplifier circuit, and the straight-through filter circuit includes a straight-through branch and three low-pass filter branches; the three low-pass filter branches are respectively 30-45MHz low-pass filter branches , 45-70MHz low-pass filter branch and 70-100MHz low-pass filter branch. In the high-frequency band processing module, the power amplifier circuit is a 110-500M power amplifier circuit, and the straight-through filter circuit includes a straight-through branch and three low-pass filter branches; the three low-pass filter branches are respectively 110-180MHz low-pass ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a high-performance full-duplex communication circuit. The high-performance full-duplex communication circuit is characterized by comprising a low-band processing module and a high-band processing module; each of the low-band processing module and the high-band processing module comprises a power amplification circuit, a straight-through filter circuit and a transmit-receive switch circuit which are connected in sequence; the power amplification circuit of the low-band processing module and the power amplification circuit of the high-band processing module are connected with a signal input port through a selective filter circuit; the transmit-receive switch circuit of the low-band processing module is in bidirectional signal connection with a low-band antenna through a directional coupling circuit; the transmit-receive switch circuit of the high-band processing module is in bidirectional signal connection with a high-band antenna through a directional coupling circuit; the transmit-receive switch circuit of the low-band processing module and the transmit-receive switch circuit of the high-band processing module are also connected with a signal receiving port through an alternative switch circuit. The communication circuit can work in a full-duplex state, and the signal transmitting and receiving performance can be improved.

Description

technical field [0001] The invention relates to the technical field of communication, more specifically, to a high-performance full-duplex communication circuit. Background technique [0002] Full duplex (Full Duplex) is a term for communication transmission. Communication allows data to be transmitted simultaneously in two directions, which is equivalent to the combination of two simplex communication methods in capability. At present, the transmission performance of high-performance full-duplex communication circuits is not very ideal. The clutter radiation signal is generated during the processing of the transmission signal, which leads to the presence of interference signals before the signal is transmitted by the antenna, which is not conducive to the subsequent reception and decoding of the signal. Therefore, a full-duplex communication circuit with good emission performance should be designed. Contents of the invention [0003] In order to overcome the disadvantag...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H04B1/40H04L5/14
CPCH04B1/40H04L5/14
Inventor 谭灵杰户大伟陈振权
Owner GUANGDONG KUANPU TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com