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Thermal deception method and thermal deception structure

A structure pair, heat source technology, applied in instrumentation, computer material science, design optimization/simulation, etc., can solve the problems of complex design process, different parameters, complex materials, etc., to achieve the effect of simple design process and easy realization

Active Publication Date: 2021-07-23
TAIYUAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the limitations of the existing thermal deception structure design process is complicated, the required materials are complicated, and the material parameters required to achieve different thermal deception effects are different, the present invention provides a New thermal deception method and structure with simple design and only the same two materials that exist in nature are required to achieve different thermal deception effects

Method used

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  • Thermal deception method and thermal deception structure
  • Thermal deception method and thermal deception structure
  • Thermal deception method and thermal deception structure

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Embodiment Construction

[0031] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described are only used to explain the present invention, but not to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary persons in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] Refer to attached figure 1 , the present invention provides a thermal deception method, comprising:

[0033] Above the actual object plane where the heat source is located, introduce a directional heat conduction structure composed of high thermal conductivity materials and low thermal conductivity materials distributed according to specific rules;

[0034] Through the directional heat co...

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Abstract

According to the thermal deception method and the thermal deception structure, a directional heat conduction structure composed of a high-heat-conductivity material and a low-heat-conductivity material which are distributed according to a specific rule is introduced above an actual object plane where a heat source (object) is located, and the directional heat conduction structure can directionally guide heat flow generated by the heat source on the actual object plane, therefore, a special thermal phantom is generated on an emergent surface (namely an observation image plane) of the directional heat conduction structure. Compared with an actual heat source, the number, the position, the size, the shape and other characteristics of the thermal illusion can be regulated and controlled by designing the heat conduction direction of the directional heat conduction structure, and then the pre-designed thermal deception effect can be achieved.

Description

technical field [0001] The invention belongs to novel thermal deception technology, in particular to a thermal deception method and a thermal deception structure. Background technique [0002] Thermal Camouflage is a new type of thermal phantom device proposed with the development of thermal metamaterials and transformation thermodynamics. When the heat flow conducts on the isotropic and uniform heat-conducting material plane, the thermal diffusion rate of the heat flow along all directions is the same, and the distribution of the temperature field is also uniform after reaching thermal equilibrium. However, if there are some other objects with different thermal conductivity on the heat conduction plane, the temperature field distribution after reaching thermal equilibrium will no longer be uniform. At this time, outside observers will "perceive" through the temperature field distribution that there are other objects on the heat conduction plane. object. To achieve thermal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/20G16C60/00G06F119/08
CPCG06F30/20G16C60/00G06F2119/08
Inventor 孙非陈汉川刘一超陈智辉刘毅彪
Owner TAIYUAN UNIV OF TECH
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