Semiconductor packaging structure and preparation method thereof
A packaging structure and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of large volume and thickness of semiconductor packaging structures, achieve precise control of height, reduce thickness and volume , Improve the effect of heat dissipation performance
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[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.
[0031] An embodiment of the present invention provides a semiconductor packaging structure. figure 1 It is a schematic structural diagram of a semiconductor package structure provided by an embodiment of the present invention. figure 2 for figure 1 Top view of the plastic enclosure. image 3 for figure 1 Bottom view of the plastic enclosure. see figure 1 , figure 2 with image 3 , the semiconductor packaging structure includes: a plastic package 10, at least one chip module 11, at least one receiving ante...
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