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Method and system for pretreating plate waste through laser cutting based on 2D vision

A laser cutting and preprocessing technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of inconvenient collection and the space occupied by the collection of plate waste

Active Publication Date: 2021-07-06
GUANGDONG UNIV OF TECH
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] The purpose of the present invention is to propose a 2D vision-based laser cutting method and system for preprocessing waste boards to solve the technical problems of waste boards taking up space and inconvenient collection

Method used

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  • Method and system for pretreating plate waste through laser cutting based on 2D vision
  • Method and system for pretreating plate waste through laser cutting based on 2D vision
  • Method and system for pretreating plate waste through laser cutting based on 2D vision

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Embodiment Construction

[0047] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0048] refer to Figure 1-3 , a method of laser cutting pretreatment plate waste based on 2D vision of the present embodiment, comprising the following steps:

[0049] Step A: Obtain the boundary information of the current sheet waste;

[0050] Step B: According to the boundary information of the current sheet waste, determine whether the current sheet waste has a boundary on the same line; if it exists, cut the sheet waste along the boundary on the same line, update the boundary information of the cut sheet waste, and then proceed to the next step One step; if it does not exist, go to the next step directly;

[0051] Step C: Using the boundary of the current sheet waste as a rectangular boundary, divide the current sheet waste into a plane, that is, draw the extension line of the boundary on the ...

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Abstract

The invention discloses a method and system for pretreating plate waste through laser cutting based on 2D vision, and relates to the technical field of plate cutting. The method for pretreating plate waste through laser cutting based on 2D vision comprises the steps that boundary information of the current plate waste is obtained; whether boundaries on the same straight line exist in the current plate waste or not is judged, and if yes, the plate waste is cut along the boundaries on the same straight line; the boundary of the current plate waste serves as a rectangular boundary, plane division is conducted on the current plate waste, multiple pre-cutting lines are obtained, and multiple to-be-cut planes are defined by the multiple pre-cutting lines and the boundaries of the current plate waste; a rectangular plane with the largest area is determined from the multiple to-be-cut planes, the current plate waste is cut according to the pre-cutting line corresponding to the rectangular plane with the largest area, and a rectangular plane plate and cut plate waste are obtained; and the above steps are iteratively conducted on the plate waste obtained after cutting until the last rectangular plane plate is obtained.

Description

technical field [0001] The present invention relates to the technical field of plate cutting, in particular to a method and system for preprocessing plate waste by laser cutting based on 2D vision. Background technique [0002] The 2D vision-based laser cutting method for preprocessing plate waste can be widely used in industrial production, such as in wood processing, glass processing, steel plate cutting, leather cutting and other manufacturing industries. When cutting rectangles of several specifications on rectangular masters such as glass plates, steel plates, and wooden boards, a polygonal waste with each side orthogonal to each other will be obtained. Unreasonable disposal of waste will cause waste of resources and even environmental pollution. , such as random discarding of plastic sheets. At present, many relevant enterprises do not pay much attention to the waste of board materials, and will not systematically process and collect the waste after collecting materia...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/70
CPCB23K26/38B23K26/702
Inventor 魏丽军张钛刘强严都喜
Owner GUANGDONG UNIV OF TECH
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