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Temperature control device and method in semiconductor process device

A technology of temperature control device and temperature control method, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problems of liquid leakage, large temperature difference, and difficulty in ensuring the uniformity and timeliness of temperature switching, so as to avoid shutdown Phenomenon, meet the process requirements, and ensure the effect of normal and stable operation

Pending Publication Date: 2021-06-22
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

[0003] However, with the continuous development of the semiconductor industry and the etching process, during the etching process of the wafer, different process steps need to use different temperatures, and the temperature difference is large. The existing single-channel ESC temperature adjustment method is difficult to guarantee the temperature. Uniformity and timeliness of switching
However, the existing dual-channel ESC temperature adjustment method is prone to the problem of liquid leakage

Method used

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  • Temperature control device and method in semiconductor process device

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Embodiment Construction

[0030] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0031] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be u...

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Abstract

The invention provides a temperature control device and method in a semiconductor process device, and the temperature control device comprises a first temperature control source, a second temperature control source, a first output pipeline, a second output pipeline, a first backflow pipeline, a second backflow pipeline, a first short-circuit pipeline, a second short-circuit pipeline, and a controller. The output ports of the two temperature control sources are respectively communicated with the inlet of a chuck through the two output pipelines, and the backflow ports of the two temperature control sources are respectively communicated with the outlet of the chuck through two backflow pipelines; the output ports of the two temperature control sources are respectively communicated with the respective backflow ports through the two short-circuit pipelines; an on-off switch is arranged on each pipeline; the controller is used for sequentially connecting or disconnecting the multiple on-off switches and switching the connection of the chuck and the two temperature control sources, and the temperatures of the temperature control media in the two temperature control sources are different. According to the present invention, the temperature control range can be widened, the temperature control time can be shortened, and the problem of fluid mixing in the two temperature control sources can be effectively solved.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, in particular to a temperature control device and method in semiconductor process equipment. Background technique [0002] The ESC (Electrostatic Adsorption Chuck) in the etching machine is mainly used for the adsorption and fixation of the wafer (wafer) and the precise temperature required for the process. Therefore, the inside of the ESC is usually provided with a channel, and the cooling / heating liquid or gas is passed into the channel through the temperature control device to precisely adjust the temperature of the ESC and make the temperature more uniform. [0003] However, with the continuous development of the semiconductor industry and the etching process, during the etching process of the wafer, different process steps need to use different temperatures, and the temperature difference is large. The existing single-channel ESC temperature adjustment method is difficult to g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67109
Inventor 徐晶晶
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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