Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A flower basket suitable for different sizes for wafer cleaning

A wafer and size technology, applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as production troubles and increase tooling costs, and achieve the effect of avoiding reserves and improving convenience

Active Publication Date: 2022-04-22
JIANGSU ASIA ELECTRONICS TECH CO LTD
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the traditional cleaning flower basket can only limit and fix a single size wafer, so different flower baskets are required for cleaning wafers of different specifications, which increases the cost of tooling and brings troubles to production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A flower basket suitable for different sizes for wafer cleaning
  • A flower basket suitable for different sizes for wafer cleaning
  • A flower basket suitable for different sizes for wafer cleaning

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Such as Figure 1-Figure 7 As shown, a flower basket suitable for different sizes for wafer cleaning includes a supporting mechanism 1 and a limiting mechanism 2 arranged on the supporting mechanism 1 for limiting and supporting the wafer. On the limiting mechanism 2 A fixing mechanism 4 for fixing the placed wafer is provided, and an adjustment mechanism 3 for limit adjustment of the limit mechanism 2 is provided at both ends of the limit mechanism 2. The adjustment mechanism 3 is connected with the limit mechanism 2, and the limit mechanism 2 is connected with the fixing mechanism 4, and the adjustment mechanism 3 is connected with the support mechanism 1;

[0046] The support mechanism 1 includes vertical plates 11 arranged on both sides to support the whole. The lower end of the vertical plate 11 is provided with a bottom plate 12 to make the overall placement stable. The vertical plate 11 is provided with a process hole, and the upper end of the vertical plate 11 i...

Embodiment 2

[0052] Such as Figure 5-Figure 8 As shown, a flower basket suitable for different sizes for wafer cleaning includes a supporting mechanism 1 and a limiting mechanism 2 arranged on the supporting mechanism 1 for limiting and supporting the wafer. On the limiting mechanism 2 A fixing mechanism 4 for fixing the placed wafer is provided, and an adjustment mechanism 3 for limit adjustment of the limit mechanism 2 is provided at both ends of the limit mechanism 2. The adjustment mechanism 3 is connected with the limit mechanism 2, and the limit mechanism 2 is connected with the fixing mechanism 4, and the adjustment mechanism 3 is connected with the support mechanism 1;

[0053] The support mechanism 1 includes vertical plates 11 arranged on both sides to support the whole. The lower end of the vertical plate 11 is provided with a bottom plate 12 to make the overall placement stable. The vertical plate 11 is provided with a process hole, and the upper end of the vertical plate 11 i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a flower basket suitable for different sizes for wafer cleaning, which includes a supporting mechanism and a limiting mechanism arranged on the supporting mechanism for limiting and supporting the wafer. The limiting mechanism A fixing mechanism for fixing the placed wafer is provided on the top. The present invention rotates the double-helix lead screw of the adjustment mechanism to make the sliders on the front and rear sides move relatively in the slide rail, adjust the distance between the first limiting plate and the second limiting plate, and make the first limiting plate and the second limiting plate The lower limit seat of the limit plate initially supports the lower side of the wafer, and then the two sides are clamped and fixed by the splint of the fixing mechanism under the force of the spring, and then the screw connected to the third limit plate is rotated to push the second The three-limiting plate moves downward to support and limit the upper part of the wafer, which is convenient for supporting and fixing wafers of different sizes, improves the convenience of wafer fixing, and avoids the reserve of multi-standard flower baskets.

Description

technical field [0001] The invention relates to the technical field of wafer cleaning, in particular to a flower basket suitable for different sizes for wafer cleaning. Background technique [0002] During the processing of the wafer, the wafer usually needs to be cleaned several times. The general method of wafer cleaning is: first place the wafer in the cleaning flower basket, and then put the cleaning flower basket with the wafer into the cleaning tank, which is equipped with cleaning agent and ultrasonic generating device. At present, the traditional cleaning flower basket can only limit and fix a single size wafer, so different flower baskets are required for cleaning wafers of different specifications, which increases the cost of tooling and brings troubles to production. Contents of the invention [0003] The object of the present invention is to provide a wafer cleaning basket suitable for different sizes in order to solve the above problems. [0004] The present...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673H01L21/67
CPCH01L21/67326H01L21/67057
Inventor 钱诚李刚李文亭
Owner JIANGSU ASIA ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products