Lower electrode assembly for plasma processing equipment and plasma processing equipment

A technology for processing equipment and plasma, used in electrical components, circuits, discharge tubes, etc., to solve problems such as static charge accumulation, and reduce electrical damage or other risks.

Active Publication Date: 2021-06-18
ADVANCED MICRO FAB EQUIP INC CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a radio frequency electrode and plasma processing equipment for plasma processing equipment, which solves the problem of static charge accumulation caused by existing high-resistance cooling pipes, and greatly reduces electrical damage or other risks caused by static charge accumulation

Method used

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  • Lower electrode assembly for plasma processing equipment and plasma processing equipment
  • Lower electrode assembly for plasma processing equipment and plasma processing equipment
  • Lower electrode assembly for plasma processing equipment and plasma processing equipment

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Embodiment Construction

[0031] based on the following Figure 1 to Figure 6 , specifically explain the preferred embodiment of the present invention.

[0032] figure 1 It is a schematic structural diagram of a plasma processing device including a radio frequency electrode provided in an embodiment of the present invention.

[0033] Such as figure 1 As shown, the plasma processing equipment includes a vacuum reaction chamber 1. A base 2 is arranged in the vacuum reaction chamber 1. An electrostatic chuck 3 is arranged on the base 2. The electrostatic chuck 3 is used to carry a substrate W to be processed. The base 2 is provided with a cooling passage 4, and the two ends of the cooling passage 4 are respectively connected with two cooling pipes 11, and the cooling pipe 11 leads out of the vacuum reaction chamber 1, and is connected with a cooling liquid storage device (not shown in the figure). 4 The insulating liquid circulates inside, and the heat on the base 2 and the electrostatic chuck 3 is tak...

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Abstract

According to a lower electrode assembly for plasma processing equipment and the plasma processing equipment, for the phenomenon that electrostatic charges in a cooling pipeline are accumulated to generate discharge to damage the lower electrode assembly, the structure of the cooling pipeline is improved, the cooling pipeline is distinguished inside and outside a radio frequency field, the cooling pipeline in the radio frequency field environment is made of a non-metal material, and the cooling pipeline in the non-radio frequency field environment has a low-resistance conductive characteristic. The problem of electrostatic charge accumulation caused by an existing high-resistance cooling pipeline is solved, and electrical damage or other risks caused by electrostatic charge accumulation are greatly reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a lower electrode assembly for plasma processing equipment and the plasma processing equipment. Background technique [0002] In the technical field of semiconductor manufacturing, it is often necessary to perform plasma treatment on the substrate to be treated. The process of performing plasma treatment on the substrate to be treated needs to be carried out in plasma treatment equipment. [0003] Plasma processing equipment generally includes a vacuum reaction chamber, and a stage for carrying substrates to be processed is arranged in the vacuum reaction chamber. The stage usually includes a base and an electrostatic chuck arranged above the base for fixing the substrate. The base is connected with a radio frequency source, and a reaction gas is introduced into the vacuum reaction chamber. Under radio frequency excitation, the reaction gas is ionized to generate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
CPCH01J37/32532H01J37/32431H01J37/32091H01J37/321
Inventor 吴磊叶如彬陈龙宝李振中徐晓磊朱文龙
Owner ADVANCED MICRO FAB EQUIP INC CHINA
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