A high-density high-frequency multi-layer flexible circuit board

Abstract

The invention discloses a high-density, high-frequency, multi-layer flexible circuit board, which comprises a circuit board body, a desiccant and a filter screen. The top and bottom of the edge of the circuit board body are respectively fixed with a first elastic rubber pad and a support column. The inside of the inner cavity is provided with a desiccant, and the high-density and high-frequency multilayer flexible circuit board is provided with a fixing rod and a fixing frame, thereby increasing the strength of the circuit board body and reducing the probability of bending and damaging the circuit board body. At the same time, a support column is provided to ensure that when the circuit board body is installed, the support column can make the circuit board body in a suspended state, thereby facilitating the heat dissipation of the circuit board body. At the same time, a desiccant is provided to ensure that the circuit board body is in use. Moisture can be absorbed by the desiccant, avoiding the short circuit of the circuit board body, and when the circuit board body is working, the heat generated can be absorbed by the desiccant, so that the moisture in the desiccant can be removed, so that the desiccant can be used repeatedly .

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a high-density and high-frequency multilayer flexible circuit board. Background technique [0002] The circuit board is an insulating board with connected conductors, on which electronic components are fixed and connected to form a circuit. Multi-layer flexible circuit board is made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness, good bending, and excellent insulation performance. . [0003] However, when the existing circuit board is installed, the distance between the circuit board and the chassis is small, resulting in poor heat dissipation of the circuit board, and at the same time in a humid environment, it is easy to cause a short circuit of the circuit board, reducing the life of the circuit board The strength of the circuit board is not high, and it is easily damaged by external...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-density high-frequency multi-layer flexible circuit board to solve the above-mentioned background technology. When the existing circuit board is installed, the distance between the circuit board and the chassis is small, resulting in the heat dissipation effect of the circuit board. At the same time, in a humid environment, it is easy to cause a short circuit of the circuit board, which reduces the life of the circuit board. At the same time, the strength of the circuit board is not high, and it is easy to be damaged by external forces.

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