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System and amethod for realizing temperature protection of loudspeaker

A loudspeaker and adder technology, applied in the system field of realizing loudspeaker temperature protection, can solve the problems of small loudspeaker volume, temperature control and low cost, etc.

Pending Publication Date: 2021-05-28
SHANGHAI FOURSEMI SEMICON CO LTD
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide a system and method for realizing the temperature protection of the loudspeaker, so as to solve the problem that the loudspeaker in the prior art cannot meet the requirements of small size, temperature control and low cost at the same time

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  • System and amethod for realizing temperature protection of loudspeaker
  • System and amethod for realizing temperature protection of loudspeaker

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Embodiment Construction

[0038] The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. The advantages and features of the present invention will be more apparent from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0039] In the following, if the methods described herein comprise a series of steps, the order of these steps presented herein is not necessarily the only order in which these steps can be performed, and some of the described steps may be omitted and / or some not described herein. Additional steps can be added to the method.

[0040] Compared with the analog interface audio amplifier, the existing digital interface audio amplifier has higher cost; the platform SOC with built-in ADSP is also owned by individual supp...

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Abstract

The invention relates to a system and a method for realizing temperature protection of a loudspeaker. The system comprises a CODEC chip, a signal receiving module which is connected with the CODEC chip through an analog interface, a gain controller module which is connected with the output end of the signal receiving module, a temperature detection signal generation module, an analog signal adder which fuses an output signal of the gain controller module and an output signal of the temperature detection signal generation module, a power amplifier which is connected with the output end of the analog signal adder, a loudspeaker which is connected with the output end of the power amplifier, a signal converter which is connected with the output end of the power amplifier, a signal processing module which is connected with the output end of the signal converter, and a temperature control algorithm module which is connected with the output end of the signal processing module. The temperature protection loudspeaker is suitable for all platforms and can realize temperature protection of the loudspeaker, so that a higher-quality sound effect is obtained, and the temperature protection loudspeaker is suitable for miniaturization and flattening development; and the cost of the audio power amplifier with temperature protection is greatly reduced, and the popularization rate is improved.

Description

technical field [0001] The invention relates to the technical field of loudspeaker manufacturing, in particular to a system and method for realizing temperature protection of the loudspeaker. Background technique [0002] With the development of miniaturization and flattening of mobile devices, the volume of speakers is compressed, and there are higher requirements for volume and sound quality. Therefore, it is necessary to accurately control the temperature of speakers. Thus, the intelligent audio power amplifier with digital interface was born, which has been widely used in mid-to-high-end equipment in recent years, and the technology and products are also very mature. However, this type of intelligent audio power amplifier must be a digital interface, and the platform has a built-in ADSP module to extract the temperature data of the speaker and adjust the audio signal. [0003] Such as figure 1 as shown, figure 1 It is the working flow diagram of the existing equipment...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R3/00G05D23/19
CPCH04R3/00G05D23/19
Inventor 丁学欣
Owner SHANGHAI FOURSEMI SEMICON CO LTD
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