CSP chip product taking and placing mechanism and using method

Abstract

The invention relates to a CSP chip product taking and placing mechanism and a using method, the CSP chip product taking and placing mechanism comprises a lining bearing linear guide mechanism, the lining bearing linear guide mechanism is located at the upper end of a device, two lining bearings and a guide rod main supporting frame are arranged in the lining bearing linear guide mechanism, and the two lining bearings are adjacently arranged at the upper end of the guide rod main supporting frame, and vertically penetrate through the guide rod main support frame to control a suction mechanism to suck and transfer a CSP chip product; a spline bearing linear guide mechanism is located at the lower end of the lining bearing linear guide mechanism and fixedly connected with the lining bearing linear guide mechanism, a spline bearing guide rod device is arranged in the spline bearing linear guide mechanism and located at the leftmost end, and a suction device is arranged on the lower portion of the spline bearing guide rod device and used for taking and placing the CSP chip product. A complex CSP chip product taking and placing mechanism and a processing grabbing mechanism can be combined, meanwhile, multiple devices can be integrated into one device, and the CSP chip product production transfer error caused by the multiple devices is reduced.

Description

technical field [0001] The invention relates to the fields of semiconductors and industrial automation, in particular to a pick-and-place mechanism for CSP chip products and a use method. Background technique [0002] CSP (Chip Scale Package) packaging is the latest generation of memory chip packaging technology and the most advanced form of integrated circuit packaging. Among various packages, this chip-scale package has the smallest area and the smallest thickness, so it is the smallest package. [0003] In the manufacturing process of the back-end production process of CSP chip products, high-speed, accurate and reliable pick-up from the wafer blue film is required for transfer or processing, such as: positioning correction, electrical testing, visual inspection, laser marking, Product classification, taping and packaging process. Since the chip-level packaging of CSP chip products has the characteristics of small area and thickness and low pressure, it is technically d...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above technical problems, a pick-and-place mechanism and usage method for CSP chip products are provided. This technical solution solves the problems of low production efficiency and low yield rate of finished products, resulting in high actual production costs.

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