Air-cooled fully-reinforced computer suitable for various series buses

Abstract

The invention discloses an air-cooled fully-reinforced computer suitable for various series buses, which comprises a box body, a front panel, a rear panel, a connecting assembly, a track bracket assembly, a heat dissipation assembly, a wire arrangement assembly and an electromagnetic shielding assembly; the rear panel is fixedly arranged at the rear end of the box body, and the front panel is arranged at the front end of the box body through the connecting assembly; the front panel is matched with the end face of the box body, a rail support used for installing a bus board card is arranged in the box body, a wire arranging assembly is arranged on the inner surface of the side wall of the box body, an air cooling heat dissipation assembly used for discharging heat generated on the bus board card is arranged on the box body, and electromagnetic shielding assemblies matched with the end face of the box body are arranged on the front panel and the rear panel. In the computer, the box body has a very good heat dissipation function, so that quick maintenance operation of a plurality of components in the box body can be realized, and the box body can also have a very good electromagnetic shielding effect.

Description

technical field [0001] The invention relates to the technical field of computer equipment, and relates to an air-cooled fully hardened computer suitable for various bus series, in particular to an air-cooled fully hardened computer using VPX, CPCI, CPCI-E, CPEX and other computer series buses. Background technique [0002] Reinforced computers have very high requirements for operational stability, and it is often required to complete the replacement of some vulnerable parts in the computer under the condition of continuous operation without downtime. The heat dissipation fan of the air-cooled chassis is a consumable component with a relatively short service life. How to realize rapid maintenance and replacement without downtime after the heat dissipation fan fails is a technical problem that needs to be solved urgently in the design of the fully ruggedized computer structure. In the prior art, most of the heat dissipation fans of fully ruggedized computer equipment are insta...

AI Technical Summary

Problems solved by technology

When multiple densely arranged vertically inserted bus boards are installed inside the chassis, the above two conventional air-cooled heat dissipation design methods cannot form an efficient heat dissipation air duct, and the heat generated by the bus boards is difficult to dissipate quickly, which easily leads to The bus board is abnormal or even burned due to excessive temperature, which greatly reduces the service life of the bus board

[0004] At the same time, there are multiple bus boards inside the cabinet, some of which are connected to the RF interface on the rear panel of the cabinet through radio frequency cables, and the bus boards are radio frequency The cables are usually in a free and unrestrained state, and due to the large number of radio frequency cables, they are very chaotic inside the box, and it is easy to cause the radio frequency cables to be wrongly connected or entangled and damaged, resulting in the failure of the normal use of the equipment

In addition, if the RF cable is damaged and needs to be replaced, it is also very troublesome and time-consuming

[0005] For reinforced computers, due to the large size of the parts of the box and the front and rear panels, it is easy to produce large dimensional tolerances and a certain degree of unevenness, resulting in a gap between the front and rear panels and the box after assembly. Uneven assembly gaps may be formed on the bonding surface of the screen. Due to the limited compression (generally only 0.15mm~0.3mm) of the shielding wire mesh set on the front and rear panels, it is difficult to fully and effectively rely on this measure alone. Eliminate the above-mentioned uneven assembly gap, so that the assembly end face of the chassis and the panel can achieve 100% continuous conductive contact, and it is difficult to ensure the effect of efficient electromagnetic shielding

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