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Micro light-emitting diode array substrate and micro light-emitting diode transfer method

A technology for micro-light-emitting diodes and array substrates, which can be applied to electrical components, electrical solid-state devices, circuits, etc., and can solve problems such as decreased adhesion, swelling, and unfavorable Micro-LED transfer yield.

Active Publication Date: 2021-05-18
YUNGU GUAN TECH CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, PDMS materials will have problems such as decreased adhesion and expansion at high temperatures, which is not conducive to the transfer yield of Micro-LEDs. Therefore, it is necessary to develop a normal temperature transfer method based on PDMS transfer heads.

Method used

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  • Micro light-emitting diode array substrate and micro light-emitting diode transfer method
  • Micro light-emitting diode array substrate and micro light-emitting diode transfer method
  • Micro light-emitting diode array substrate and micro light-emitting diode transfer method

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Embodiment Construction

[0020] In the transfer process of transferring micro-light-emitting diodes in batches with polydimethylsiloxane (PDMS) transfer heads, it is necessary to use PDMS transfer heads to pick up micro-light-emitting diodes from the surface of the temporary bonding adhesive. The commonly used temporary bonding adhesive materials are based on the material Properties can be divided into thermoplastic, UV-sensitive and so on. For thermoplastic temporary bonding substrates, the glue can be changed from solid to liquid by heating, so as to realize the pick-up of micro light-emitting diodes by the PDMS transfer head, but the general process temperature is above 150°C, which will affect the properties of the PDMS transfer head . One of the alternatives is to soak in the cleaning solution of the temporary bonding glue after the PDMS transfer head and the temporary bonding substrate are bonded. After the temporary bonding glue dissolves, the micro-LEDs will stay on the PDMS transfer head. . ...

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PUM

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Abstract

The invention provides a micro light-emitting diode array substrate and a micro light-emitting diode transfer method. The micro light-emitting diode array substrate specifically comprises a substrate and a plurality of micro light-emitting diodes arranged on the substrate in an array mode. The adjacent micro light emitting diodes are separated by a metal block, and the height of the metal block in the direction perpendicular to the substrate is greater than that of the micro light-emitting diodes. In this way, in the transferring process, a groove is reserved in the temporary bonding glue after the metal block is removed, and the temporary bonding glue is removed by introducing a cleaning agent into the groove, so that the micro light-emitting diodes are picked up by the polydimethylsiloxane transferring device at the normal temperature, and the transferring yield of the micro light-emitting diodes is increased.

Description

technical field [0001] The invention relates to the transfer of micro light emitting diodes, in particular to a micro light emitting diode array substrate and a transfer method of micro light emitting diodes. Background technique [0002] With the rapid development of the display industry and the continuous update and iteration of display technology, Micro Light-emitting Diodes (Micro-LED) display technology is expected to become the next generation mainstream display technology. Compared with the current OLED display technology, Micro-LED display technology has higher brightness, better luminous efficiency and lower power consumption, and has obvious technical advantages. [0003] Micro light-emitting diodes refer to micron-sized light-emitting diodes (Light-emitting Diodes, LEDs). The batch transfer process is the most important part of Micro-LED technology, including temporary bonding, laser lift-off, pick-up and binding. Among them, there are many kinds of transfer head...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L21/67
CPCH01L21/67144H01L27/156H01L21/67017
Inventor 夏继业曹轩董小彪姚志博王岩李晓伟郭剑王程功
Owner YUNGU GUAN TECH CO LTD
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