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Manufacturing method of antenna cover plate and electronic equipment

A manufacturing method and antenna cover technology, which is applied to antennas, electronic equipment, antenna parts, etc., can solve the problems of low yield rate of antenna cover plates

Inactive Publication Date: 2021-05-11
NANCHANG O FILM DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a method for manufacturing an antenna cover and electronic equipment, aiming to solve the problem of low yield in the existing method for producing an antenna cover

Method used

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  • Manufacturing method of antenna cover plate and electronic equipment
  • Manufacturing method of antenna cover plate and electronic equipment
  • Manufacturing method of antenna cover plate and electronic equipment

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Embodiment Construction

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the specific embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0047] At present, antenna design of electronic products is based on flexible printed circuit (FPC) and laser direct structuring (LDS) technology. With the increasing proportion of full-screen screens and the arrival of 5G, there are more and more requirements for the location and area of ​​antennas. The antenna design on the top and bottom of the conventional screen cannot meet the structural design requirements of electronic products. ...

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Abstract

The invention discloses a manufacturing method of an antenna cover plate and electronic equipment, and the method comprises the steps of: forming a demolding layer on a substrate; forming an antenna layer on the demolding layer to prepare an antenna diaphragm; attaching one surface of the antenna layer of the antenna diaphragm to a cover plate; and tearing off the substrate and the demolding layer so as to form the antenna layer on the cover plate. According to the technical scheme, the antenna diaphragm is firstly manufactured, then the antenna diaphragm is attached to the cover plate, and finally the substrate and the demolding layer of the antenna diaphragm are torn off, so that the antenna layer of the antenna diaphragm is transferred to the cover plate, and the manufacturing process of the antenna cover plate is simple and high in yield. Through the manufacturing method, the antenna layer can be placed at any position of the shell of the electronic equipment, the appearance is not influenced, the signal is enhanced, and the transmission / receiving effect is good.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a manufacturing method of an antenna cover plate and electronic equipment. Background technique [0002] At present, antenna design of electronic products is based on flexible printed circuit (FPC) and laser direct structuring (LDS) technology. With the increasing proportion of full-screen screens and the arrival of 5G, there are more and more requirements for the location and area of ​​antennas. The antenna design on the top and bottom of the conventional screen cannot meet the structural design requirements of electronic products. The antenna design has gradually begun to be designed on the back cover, front cover and frame to form the antenna cover. The existing manufacturing method of the antenna cover generally adopts the method of direct embossing to form the antenna layer on the cover. However, the production method of this antenna cover has the problem of low yield r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/36B32B33/00B32B7/06B32B9/00B32B9/04B32B7/12B32B15/02B32B15/09B32B37/02B32B37/12B32B1/00B32B38/00H01Q1/22H01Q1/24H01Q1/36H01Q1/38B29D7/01
CPCB29D7/01B32B1/00B32B5/028B32B7/06B32B7/12B32B9/00B32B9/04B32B15/02B32B15/09B32B27/36B32B33/00B32B37/02B32B37/1284B32B38/145B32B2037/243B32B2255/02B32B2262/103B32B2307/202B32B2457/00H01Q1/22H01Q1/242H01Q1/36H01Q1/38
Inventor 唐根初周天宝简建明
Owner NANCHANG O FILM DISPLAY TECH CO LTD
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