Chip circuit board with protection structure

A protection structure and circuit board technology, applied in the structural connection of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of poor corrosion resistance, short service life of circuit boards, and poor protection.

Inactive Publication Date: 2021-05-07
深圳爱仕特科技有限公司
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a chip circuit board with a protective structure, by setting the first transparent protective film, the second transparent protective film, the third transparent protective film, the first rubber s

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip circuit board with protection structure
  • Chip circuit board with protection structure
  • Chip circuit board with protection structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0027] see Figure 1-6 As shown, the present invention is a chip circuit board with a protective structure, including a first transparent protective film 100, a first circuit board 200, a second circuit board 500, a third circuit board 800 and a first rubber sleeve 900, the first A first transparent protective film 100 is pasted on the top of a circuit board 200 , a first film 300 is pasted and fixed on the bottom of the first circuit board 200 , and the first circ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a chip circuit board with a protection structure, and relates to the technical field of electronic materials. The chip circuit board comprises a first transparent protective film, a first circuit board, a second circuit board, a third circuit board and a first rubber sleeve, the first transparent protective film is attached to the upper portion of the first circuit board, a first film is fixed to the lower portion of the first circuit board in an attached mode, the first circuit board is fixed to the second circuit board below through the first film in an adhesive mode, and the second circuit board is bonded and fixed with a third circuit board below the second circuit board through a second film, the first circuit board, the second circuit board and the third circuit board are inserted into a protection structure consisting of a first rubber sleeve, a second rubber sleeve, a third rubber sleeve and a fourth rubber sleeve. By arranging the first transparent protective film, the second transparent protective film, the third transparent protective film, the first rubber sleeve, the second rubber sleeve, the third rubber sleeve and the fourth rubber sleeve, the problem that the service life of the circuit board is short due to the fact that the circuit board is poor in protection performance and corrosion resistance is solved.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, in particular to a chip circuit board with a protective structure. Background technique [0002] Electronic materials refer to materials used in electronic technology and microelectronic technology. Electronic materials are the material basis for the development of modern electronics industry and science and technology. Circuit boards are of great significance in electronic materials. Circuit boards make circuits miniaturized and intuitive. It plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances, but the existing circuit boards have the following defects: [0003] 1. Poor protection, the circuit board is easily squeezed or stretched by external pressure during installation and use, resulting in damage to the circuit board. [0004] 2. Poor corrosion resistance. Under realistic conditions, such as chemical environment (fuel, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/02H05K1/14
CPCH05K1/02H05K1/144
Inventor 姚金才陈宇朱超群
Owner 深圳爱仕特科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap