A dynamically tunable multifunctional terahertz metamaterial device based on tini shape memory alloy thin films
A memory alloy and multifunctional technology, which is applied in the field of terahertz metamaterial functional devices, can solve the problems of single function, complex structure and limited control range of devices
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment approach 1
[0021] Specific implementation mode one: as Figure 1 ~ Figure 3 As shown, a dynamically adjustable multifunctional terahertz metamaterial device based on a TiNi shape memory alloy thin film in this embodiment includes a substrate 1 and an split resonator ring structure thin film layer, and the split resonator ring structure thin film layer is arranged on the substrate The upper surface of the bottom 1; the split resonator structure film layer includes N×N split resonator structure periodic units, and the split resonator structure periodic unit includes a single split resonator structure 2 and is symmetrically arranged on the single split resonator structure 2. Two bendable arm structures 3 at the opening; the single-opening resonant ring structure 2 is square.
[0022] In this embodiment, the shape memory alloy (SMA) is one of the most typical metal smart materials, which realizes deformation recovery through martensitic phase transformation under the action of an external fi...
specific Embodiment approach 2
[0026] Embodiment 2: This embodiment differs from Embodiment 1 in that the substrate 1 is a low-doped high-resistance silicon substrate with a thickness of 5 μm and a dielectric constant of 11.86. Other steps and parameters are the same as in the first embodiment.
specific Embodiment approach 3
[0027] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the material of the thin film layer of the split resonator ring structure is TiNi shape memory alloy. Other steps and parameters are the same as those in Embodiment 1 or 2.
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
width | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com