Solid-state relay

Abstract

The invention belongs to the technical field of relay heat dissipation and discloses a solid-state relay. The solid-state relay comprises a heat conduction plate, a mounting plate, a heat conduction copper ring, a limiting ring A and a limiting ring B; a solid-state relay is fixedly installed at the bottom of the heat conduction plate; a heat conduction seam is formed in the middle of the top end of the solid-state relay; transparent pipes are symmetrically and fixedly installed on the left side and the right side of the bottom of the solid-state relay; inner cavities of the two transparent pipes are communicated with an inner cavity of the heat conduction seam; fixing screws are in threaded connection with the bottoms of the two transparent pipes; and rubber plugs are fixedly bonded to the tops of the two sets of fixing screws. In an actual use process, fan blades A and fan blades B blow air to heat dissipation fins A and heat dissipation fins B through rotation correspondingly, so that the air flow speed in the solid-state relay is increased, heat on the heat conduction copper pipe, the heat dissipation plate A, the heat dissipation plate B, the heat dissipation fins A and the heat dissipation fins B can be dissipated more quickly, and therefore, the heat dissipation speed of the solid-state relay is further increased.

Description

technical field [0001] The invention relates to the technical field of relay heat dissipation, in particular to a solid-state relay. Background technique [0002] Solid State Relay (SOLIDSTATERELAYS, hereinafter abbreviated as "SSR") is a new type of non-contact switching device composed of solid-state electronic components, which utilizes the switching characteristics of electronic components (such as switching transistors, triacs, etc. , It can achieve the purpose of connecting and disconnecting the circuit without contact and spark, so it is also called "contactless switch". [0003] The load of the solid-state relay is obviously related to the ambient temperature. As the temperature rises, the load capacity will drop rapidly. Therefore, it is necessary to dissipate the heat generated by the solid-state relay in time to avoid excessive temperature of the solid-state relay. [0004] In the actual use of existing solid state relays, the contact between the heating surface ...

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Problems solved by technology

[0004] In the actual use of existing solid state relays, the contact between the heating surface and the heat dissipation structure is not sufficient, resulting in insufficient heat conduction area and low heat dissipation efficiency, and the heat dissipation area of ​​the solid state relay is small, and the air velocity on the surface of the heat dissipation structure is relatively low. Slow, the heat on the surface of the heat dissipation structure cannot be quickly dissipated into the air, resulting in low heat dissipation efficiency of the solid state relay, affecting the normal use of the solid state relay

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