High-tensile-resilience heat-resistant pressure-sensitive adhesive and preparation method thereof

A technology of resilience and heat resistance, which is applied in the field of preparation of high tensile resilience heat-resistant pressure-sensitive adhesives and high-stretch resilience heat-resistant pressure-sensitive adhesives, which can solve the deformation of pressure-sensitive adhesives and unstable performance of electronic products , poor heat resistance and other problems, to achieve the effect of good initial adhesion and holding force, high market application prospects, and good stretching resilience

Inactive Publication Date: 2021-04-02
张家港保税区汇英聚福材料科技合伙企业(有限合伙)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The technology described by this inventor allows for better control over its properties when used with certain materials like rubber or plastics during manufacturing processes such as bonding them together without causing damage due to excessively large forces applied on it. This results in improved durability and stability even after being exposed to harsh environments where they may have been subjected repeatedly to thermal stress cycles.

Problems solved by technology

The technical problem addressed in this patented text relates to improving the efficiency at removing excess heat from electronic devices while maintaining their thinness or lighter weight without losing functionality due to insufficient coolant flow caused by conventional methods such as glue stickers that use static electricity.

Method used

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  • High-tensile-resilience heat-resistant pressure-sensitive adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0059] A heat-resistant pressure-sensitive adhesive with high tensile resilience, by weight components, comprising the following components:

[0060] 20 parts of alkoxyalkyl (meth)acrylate

[0061] 3 parts of 2-acrylamide-2-methylpropanesulfonic acid

[0062] 2,4-toluene diisocyanate 2 parts

[0063] 5 parts of 1,4-butanediol diacrylate

[0064] 3 parts of 2,2'-azobisisobutyronitrile

[0065] 1 part melamine formaldehyde resin

[0066] SEBS0.2 copies

[0067] Acrylonitrile 4 parts

[0068] 2 parts isooctyl acrylate

[0069] 0.8 parts of O-(7-azabenzotriazol-1-yl)-N,N,N',N'-tetramethyluronium hexafluorophosphate

[0070] 0.5 parts of methyl ethyl ketone peroxide

[0071] 30 parts of ethyl acetate.

[0072] The preparation method of the above-mentioned high tensile resilience heat-resistant pressure-sensitive adhesive comprises the following steps:

[0073] (1) Add alkoxyalkyl (meth)acrylate, 2,4-toluene diisocyanate, 1,4-butanediol diacrylate, isooctyl acrylate, ethyl...

Embodiment 2

[0077] A heat-resistant pressure-sensitive adhesive with high tensile resilience, by weight components, comprising the following components:

[0078] 25 parts of alkoxyalkyl (meth)acrylate

[0079] 5 parts of 2-acrylamide-2-methylpropanesulfonic acid

[0080] 3 parts of 2,4-toluene diisocyanate

[0081] 7 parts of 1,4-butanediol diacrylate

[0082] 4 parts of 2,2'-azobisisobutyronitrile

[0083] 2 parts melamine formaldehyde resin

[0084] SEBS0.5 parts

[0085] Acrylonitrile 5 parts

[0086] 3 parts isooctyl acrylate

[0087] 0.8 parts of O-(7-azabenzotriazol-1-yl)-N,N,N',N'-tetramethyluronium hexafluorophosphate

[0088] 0.6 parts of methyl ethyl ketone peroxide

[0089] 35 parts of ethyl acetate.

[0090] The preparation method of the above-mentioned high tensile resilience heat-resistant pressure-sensitive adhesive comprises the following steps:

[0091] (1) Add alkoxyalkyl (meth)acrylate, 2,4-toluene diisocyanate, 1,4-butanediol diacrylate, isooctyl acrylate, et...

Embodiment 3

[0095] A heat-resistant pressure-sensitive adhesive with high tensile resilience, by weight components, comprising the following components:

[0096] 30 parts of alkoxyalkyl (meth)acrylate

[0097] 8 parts of 2-acrylamide-2-methylpropanesulfonic acid

[0098] 4 parts of 2,4-toluene diisocyanate

[0099] 8 parts of 1,4-butanediol diacrylate

[0100] 5 parts of 2,2'-azobisisobutyronitrile

[0101] 3 parts melamine formaldehyde resin

[0102] SEBS0.6 copies

[0103] Acrylonitrile 6 parts

[0104] 4 parts isooctyl acrylate

[0105] 1 part of O-(7-azabenzotriazol-1-yl)-N,N,N',N'-tetramethyluronium hexafluorophosphate

[0106] 0.8 parts of methyl ethyl ketone peroxide

[0107] 40 parts of ethyl acetate.

[0108] The preparation method of the above-mentioned high tensile resilience heat-resistant pressure-sensitive adhesive comprises the following steps:

[0109] (1) Add alkoxyalkyl (meth)acrylate, 2,4-toluene diisocyanate, 1,4-butanediol diacrylate, isooctyl acrylate, ethy...

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Abstract

The invention relates to a high-tensile-resilience heat-resistant pressure-sensitive adhesive which comprises the following components in parts by weight: alkoxyalkyl (meth)acrylate, 2-acrylamide-2-methyl propanesulfonic acid, 2, 4-toluene diisocynate, 1, 4-butanediol diacrylate, 2, 2'-azodiisobutyronitrile, melamino-formaldehyde resin, SEBS, acrylonitrile, 2-ethylhexyl acrylate, O- (7-azabenzotriazole-1-yl) N, N, N', N'-tetramethylurea hexafluorophosphate, methyl ethyl ketone peroxide and ethyl acetate. The high-tensile-resilience heat-resistant pressure-sensitive adhesive disclosed by the invention is good in initial adhesion and permanent adhesion, can still keep relatively high viscosity at high temperature, is good in telescopic resilience and small in deformation degree at high temperature, is strong in heat resistance, can keep stable performance at high temperature, and has an extremely high market application prospect.

Description

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Claims

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Application Information

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Owner 张家港保税区汇英聚福材料科技合伙企业(有限合伙)
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