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Control method for full-automatic flatness measurement

A control method and flatness technology, applied in the control field of automatic flatness measurement, can solve the problems of low accuracy of measuring PCB board flatness, and achieve the effect of large compatibility and high detection accuracy

Inactive Publication Date: 2021-04-02
UNIONMANTECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a control method for fully automatic flatness measurement, and the technical solution provided by the present invention solves the problem of low accuracy in measuring the flatness of PCB boards in the prior art

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  • Control method for full-automatic flatness measurement
  • Control method for full-automatic flatness measurement

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] In order to solve the above-mentioned technical problems, this embodiment provides a control method for fully automatic flatness measurement, which is used to measure the flatness of the PCB surface by using a measuring device with a grabbing device and a test platform. Since the PCB specification is in the form of a module, the Hereinafter referred to as modules. Wherein, the grabbing device can be moved onto the test platform, and the test platform is f...

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Abstract

The invention relates to the technical field of flatness measurement, in particular to a control method for full-automatic flatness measurement. A two-dimensional code on a module is identified and read through a grabbing device, the module is positioned through the two-dimensional code, and the module is transferred to a test platform; the test platform performs value taking on the surface of themodule according to a preset value taking point and calculates the actual planeness of the module; and the flatness of the surface of a PCB module is measured by controlling measuring equipment withthe grabbing device and the test platform, so that the flatness of the PCB module can be measured without manually adopting a micrometer and a feeler gauge, finally, the automatic flatness testing andsorting results of the module are achieved, the detection production efficiency is greatly improved while manpower and material resources are saved, a laser displacement sensor is adopted to carry out nine-point point taking in a shape like a Chinese character 'tian' on the module, and the point taking mode has the advantages that the point taking mode is not affected by factors such as the surface and the length of the module, compatibility is large, the method is suitable for PCB modules of various specifications, and detection precision is high.

Description

technical field [0001] The invention relates to the technical field of flatness measurement, in particular to a control method for full-automatic flatness measurement. Background technique [0002] In the processing process of the existing PCB board, because the PCB board needs to withstand high temperature during SMT placement and furnace passing, the ultra-high temperature will be transmitted to the PCB board, because different areas on the PCB board have different devices and Wiring will easily lead to inconsistent cooling speeds in different areas of the PCB board after the furnace, and eventually lead to deformation of the cooled PCB board, thus forming a semi-finished PCB board with poor flatness. Due to the poor flatness of the semi-finished PCB board, the height of the pins of different semi-finished PCB boards is inconsistent during the second placement, resulting in the failure of the semi-finished PCB to be welded to the bottom plate normally, resulting in materia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/10B07C5/36
CPCB07C5/10B07C5/362
Inventor 钟兆华林榕许华何强
Owner UNIONMANTECH
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