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Ultrathin wafer processing device

A technology for processing devices and wafers, which is applied in the direction of grinding devices, metal processing equipment, manufacturing tools, etc., which can solve the problem of reduced friction between the polishing pad and the wafer, easy decrease of the surface roughness of the polishing pad, and difficulty on the side of the wafer. Fitting and fixing problems, to prevent inconsistent thickness, prevent incomplete grinding, and avoid frequent disassembly and replacement

Active Publication Date: 2021-03-16
临漳县澳皇网络科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The wafer grinding device uses the friction between the wafer and the grinding pad, and with the help of the grinding liquid, the fine chips after wafer grinding follow the flow of the grinding liquid, preventing the fine chips from rubbing the wafer surface again, and making the wafer The flatness of the round surface increases, but after the friction between the wafer surface and the polishing pad, the roughness of the polishing pad surface tends to decrease, resulting in a decrease in the friction between the polishing pad and the wafer. Replacement, frequent disassembly will easily lead to loosening of the fixing device, and the thinner wafer side is not easy to be fixed, and the outer side of the wafer is easy to extend under the grinding force, which easily leads to inconsistent thickness of the outer side of the wafer, so it is easy to be damaged under the rotating grinding force. to tear

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0025] Such as Figure 1-Figure 5 Shown:

[0026] An ultra-thin wafer processing device according to the present invention, its structure includes a processing mechanism 1, a rotator 2, a control switch 3, and a workbench 4, the rotator 2 and the processing mechanism 1 are located on the same central axis, and the control switch 3 Embedded on the upper surface of the workbench 4, the processing mechanism 1 is installed on the upper end of the workbench 4, the rotator 2 is fixed on the upper end of the workbench 4, the processing mechanism 1 is provided with a fixed plate 11, a retractor 12, a grinding Structure 13, rotating plate 14, fixed structure 15, the fixed plate 11 runs through the inside of the retractor 12, the grinding structure 13 is fixedly attached to the inside of the lower end of the expander 12, and the lower end of the fixed plate 11 runs through the grinding structure 13 Inside, the fixed structure 15 and the grinding structure 13 are located on the same cen...

Embodiment 2

[0033] Such as Figure 6-Figure 8 Shown:

[0034]Wherein, the grinding structure 13 is provided with a grinding plate w1, a friction structure w2, an air hole w3, and a fixed ring w4, the friction structure w2 runs through the inside of the grinding plate w1, and the air holes w3 are provided with thirty The plate w1 is circularly distributed at the center point and runs through each other. The fixed ring w4 is welded on the outside of the grinding plate w1. The friction structure w2 is located on both sides of the air hole w3. The fixed ring w4 is embedded and fixed on the inner side of the lower end of the retractor 12. The friction structure w2 spreads out from the central axis of the grinding plate w1, and the diffusion becomes larger as it goes to the outside, so that the grinding plate w1 rotates to grind the wafer, and the heat generated by friction is diffused through the vent hole w3.

[0035] Wherein, the friction structure w2 is provided with a fitting plate w21, a...

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Abstract

The invention discloses an ultrathin wafer processing device. The structurally of the device comprises a processing mechanism, a rotator, a control switch and a workbench, the rotator and the processing mechanism are located on the same central axis, the control switch is fixedly embedded in the surface of the upper end of the workbench, the processing mechanism is installed at the upper end of the workbench, and the rotator is fixed to the upper end of the workbench. The extending part of the outer side of the wafer acts on a friction block, the wafer rotates reversely to act on a continuousbending structure of the friction block and a bending plate, attaching force is generated on the wafer, the smoothness of the outer side of the wafer is enhanced while the outer side of the wafer is prevented from extending, the problem that the thickness of the outer side of the wafer is inconsistent is solved, after the wafer is lost, a grinding structure is controlled to ascend and descend, a fixing ring drives a grinding plate to ascend and descend, so that a stress structure and a attaching plate are exposed through a gap groove, the length of the stress structure is increased, the attaching friction force of an arc-shaped knife edge in a supporting rod to the wafer is enhanced, frequent disassembly and replacement after grinding loss are avoided, and the situation that the accuracy of the grinding structure is affected by frequent disassembly and installation is prevented.

Description

[0001] The invention relates to the field of wafer coating, in particular to an ultra-thin wafer processing device. Background technique [0002] The wafer grinding device uses the friction between the wafer and the grinding pad, and with the help of the grinding liquid, the fine chips after wafer grinding follow the flow of the grinding liquid, preventing the fine chips from rubbing the wafer surface again, and making the wafer The flatness of the round surface increases, but after the friction between the wafer surface and the polishing pad, the roughness of the polishing pad surface tends to decrease, resulting in a decrease in the friction between the polishing pad and the wafer. Replacement, frequent disassembly will easily lead to loosening of the fixing device, and the thinner wafer side is not easy to be fixed, and the outer side of the wafer is easy to extend under the grinding force, which easily leads to inconsistent thickness of the outer side of the wafer, so it is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/10B24B37/34B24B27/00B24B41/00B24B37/30H01L21/304
CPCB24B37/107B24B37/34B24B27/0046B24B41/007B24B37/30H01L21/304
Inventor 赵震
Owner 临漳县澳皇网络科技有限公司
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