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LED inorganic packaging method

A packaging method and inorganic technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problem of airway left in sealant

Active Publication Date: 2021-03-12
HONGLI ZHIHUI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a LED inorganic packaging method to solve the problem of air passages left in the sealant due to unbalanced air pressure during the heating process

Method used

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  • LED inorganic packaging method
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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings of the description.

[0022] Such as figure 1 As shown, an LED inorganic packaging structure includes a metal support 1 and a glass cover 2 covering the metal support 1 . The metal support 1 includes a ceramic substrate 13 and a surrounding frame 12 arranged on the ceramic substrate 13; a groove is arranged on the inner side of the top of the surrounding frame 12, and the edge of the glass cover plate 2 is arranged in the groove, and the glass cover 2 The top of the plate 2 is flush with the top of the surrounding frame 12; the groove is provided with glue 3, and the glass cover 2 cooperates with the metal bracket 1 to form a closed space 11; the edge of the glass cover 2 is a bevel 21, The glue 3 covers the edge of the glass cover 2, and the bevel 21 on the edge of the glass cover 2 makes the contact area with the glue larger. Meanwhile, the glue 3 is pressed on the bev...

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Abstract

An LED inorganic packaging method comprises the following steps: (1) carrying out die bonding in a metal support; (2) dispensing glue on the top of the enclosure frame of the metal bracket; (3) enabling a glass cover plate to cover the top of the metal support, and attaching the edge of the glass cover plate to the top of the surrounding frame through glue; (4) moving the metal bracket communicated with the glass cover plate into a high-pressure heating pot, and heating and curing the glue by utilizing heat radiation on the inner wall of the high-pressure heating pot; (5) in the heating process, enabling the air pressure in a closed space defined by the metal support and the glass cover plate and the air pressure in the sealed high-pressure heating pot to reach a balanced state; and (6) after heating and curing are finished, taking out the metal bracket after the pressure in the high-pressure heating pot is recovered to normal pressure, thereby finishing inorganic packaging of the LED.After heating, the air pressure in the metal bracket rises, and meanwhile, the air pressure in the high-pressure heating pot rises, so that the internal and external air pressures of the metal bracket are still kept balanced, and the glue cannot generate an internal air passage caused by unbalanced air pressure.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to an inorganic LED packaging method. Background technique [0002] At present, it is known that deep-ultraviolet LEDs need to be packaged inorganically, and there are more forms than inorganic packaging. However, metal brackets and glass cover plates are usually used for inorganic packaging. The packaging process is as follows: solidify the crystal in the metal bracket, Glue on the top of the metal bracket, cover the glass cover on the top of the metal bracket, put the metal bracket connected with the glass cover into a hot air circulation furnace for baking, and use the circulating hot air to cure the glue. Although the above heating method can also solidify the glue to combine the glass cover plate with the metal bracket, due to the heating and expansion of the gas in the metal bracket during the heating process, the air pressure in the metal bracket will increase, while the pressure...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52
CPCH01L33/48H01L33/52H01L2933/0033H01L2933/005
Inventor 梁依雯赵明深王芝烨
Owner HONGLI ZHIHUI GRP CO LTD
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