Heat dissipation device of semiconductor power device, control method of heat dissipation device, motor and household appliance

A technology of power devices and heat sinks, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problem of low heat dissipation efficiency of power devices, and achieve the effect of improving the low heat dissipation efficiency

Pending Publication Date: 2021-03-09
GREE ELECTRIC APPLIANCES INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims to provide a heat dissipation device for semiconductor power devices and its control method, motors and household appliances, so as to improve the problem of low heat dissipation efficiency of power devices in the related art

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  • Heat dissipation device of semiconductor power device, control method of heat dissipation device, motor and household appliance
  • Heat dissipation device of semiconductor power device, control method of heat dissipation device, motor and household appliance
  • Heat dissipation device of semiconductor power device, control method of heat dissipation device, motor and household appliance

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Embodiment Construction

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0049] figure 1 shows a schematic structural view of the heat dissipation device of the power device in this embodiment, figure 2 A control block diagram of the heat dissipation device of the power device in this embodiment is shown.

[0050] combine figure 1 and figure 2 As shown, the heat dis...

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Abstract

The invention relates to a heat dissipation device of a semiconductor power device and a control method thereof, a motor and a household electrical appliance. The heat dissipation device of the powerdevice comprises a semiconductor chilling plate (2) configured to cool the power device (1); a driving control circuit including a semiconductor switching element (Q) electrically connected to the semiconductor chilling plate (2); a temperature sensor (6) configured to detect a temperature of the power device (1); and a control unit which is in signal connection with the semiconductor switching element (Q) and the temperature sensor so as to adjust the power of the semiconductor chilling plate (2) according to the temperature change of the power device (1), wherein the control unit is configured to adjust the power of the semiconductor chilling plate (2) by transmitting a pulse width modulation signal to the semiconductor switching element (Q). The heat dissipation device is advantaged inthat the semiconductor chilling plate (2) with the refrigeration function is used for cooling the power device (1), and a problem that in the related technology, heat dissipation efficiency of the power device (1) is low is solved.

Description

technical field [0001] The present invention relates to the field of household appliances, in particular to a heat dissipation device for a semiconductor power device, a control method thereof, a motor and a household appliance. Background technique [0002] With the continuous development of industrial automation, the demand for motor control is also increasing, and motor control is inseparable from power devices (including IGBT, IPM, PIM, etc.). In the process of controlling the operation of the motor, the power device will generate a lot of heat. If the heat dissipation is not good, it will affect the operation of the motor and even cause the power device to burn out, resulting in certain losses. The power used by current power devices is also increasing, and the corresponding heat generated is also increasing, which also puts forward higher requirements for the heat dissipation design of power devices. [0003] At present, there are two main heat dissipation methods for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/38H01L23/467
CPCH01L23/38H01L23/467
Inventor 高雅梅正茂李赛魏朋朋
Owner GREE ELECTRIC APPLIANCES INC
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