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Test probe cleaning method and friction resistance scraping, viscous adsorption and probe fixing method

A testing probe, cleaning technology, applied in the direction of cleaning methods and utensils, cleaning methods using tools, chemical instruments and methods, etc., can solve the problems of manual cleaning probe cleaning and so on

Active Publication Date: 2021-03-09
FTDEVICE TECH (SUZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to overcome the above-mentioned deficiencies in the prior art, the present invention provides a test probe cleaning method and friction scraping, viscous adsorption and probe fixing methods to solve the existing problems of how to effectively replace manual cleaning and how to remove the probe thorough cleaning problem

Method used

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  • Test probe cleaning method and friction resistance scraping, viscous adsorption and probe fixing method
  • Test probe cleaning method and friction resistance scraping, viscous adsorption and probe fixing method
  • Test probe cleaning method and friction resistance scraping, viscous adsorption and probe fixing method

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specific Embodiment approach 1

[0050] The following is a specific implementation of a test probe cleaning device of the present invention.

[0051] The test probe cleaning device under the present embodiment, such as Figure 1-9As shown, the test probe cleaning device includes a cleaning component 1, a clamping component 2, a test socket 3, a test base 4 and a test probe 5; the clamping component 2 is arranged above the cleaning component 1, and the cleaning component 1 is provided with a test socket 3 below, and the test socket 3 is installed on the test base 4. The clamping member 2 can control the cleaning member 1 above the test socket 3 through the movement of the transmission mechanical arm, and the cleaning member 1 can be moved to In the test socket 3, and fit against the probe of the test probe 5 in the test socket 3, to complete the work of scraping off the accumulated impurities on the test probe 5 first, and then absorbing and removing the impurities and dust from the test socket 3 , that is, t...

specific Embodiment approach 2

[0065] The following is a specific implementation of a test base of a test probe cleaning device of the present invention.

[0066] It should be noted that the test base of a test probe cleaning device in this embodiment can be implemented separately, that is, it can exist independently as a part of a test probe cleaning device, or it can be described in Embodiment 1. A test probe cleaning device is further defined.

[0067] The test base of the test probe cleaning device under the present embodiment, such as figure 1 , 2 , 7, 8, the test base of the probe cleaning device includes a base body 4-1, a first limiting clip 4-3, a second limiting clip 4-4, a first lead screw nut 4 -5, the second lead screw nut 4-6, the first adjusting bolt 4-7, the second adjusting bolt 4-8; the side wall of the base body 4-1 is symmetrically opened with two groups of strip-shaped through holes 4-2 , the first limiting clip 4-3 and the second limiting clip 4-4 are movably arranged in two groups ...

specific Embodiment approach 3

[0072] The following is a specific implementation of a clamping member of a test probe cleaning device of the present invention.

[0073] It should be noted that the clamping member of a test probe cleaning device in this embodiment can be implemented separately, that is, it can exist independently as a part of a test probe cleaning device, or it can be described in Embodiment 1. A test probe cleaning device is further defined.

[0074] The clamping member of the test probe cleaning device under the present embodiment, such as figure 1 , 2 , 9, the clamping member of the probe cleaning device includes a clamping body 2-1, an air pipeline 2-3, and a sealing plate 2-4; the lower part of the inner cavity of the clamping body 2-1 is provided with an adsorption port 2-2, there is an air pipeline 2-3 inside the clamping body 2-1, the suction end of the air pipeline 2-3 reaches the suction port 2-2, and the clamping body 2-1 can pass through the air pipeline The adsorption port 2-...

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Abstract

The invention discloses a test probe cleaning method and friction scraping, viscous adsorption and probe fixing methods, relates to the technical field of semiconductors, and aims to solve the problems of how to effectively replace manual cleaning and how to thoroughly clean a probe in the prior art. A test probe cleaning device comprises a cleaning component, a clamping component, a test socket,a test base and a test probe. The clamping component is arranged above the cleaning component, a test socket is arranged below the cleaning component, the test socket is installed on the test base, and the clamping component can move and control the cleaning component above the test socket through a transmission mechanical arm so that the cleaning component can move into the test socket, and is abutted against the probe head of the test probe in the test socket. The problems of how to effectively replace manual cleaning and how to thoroughly clean the probe in the prior art are solved, so thatmanual cleaning is effectively replaced, and meanwhile, the cleaning quality and the testing efficiency are ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for cleaning test probes and methods for friction scraping, viscous adsorption and probe fixing. Background technique [0002] The last process of semiconductor manufacturing is testing. The testing process can be divided into preliminary testing and final testing. Its main purpose is not only to find defects in semiconductor components, but also to classify semiconductor components according to specifications. In the process of testing a semiconductor component such as a chip, the probe will make electrical contact with the pins on the semiconductor component, such as solder balls, to test the relevant electrical properties of the semiconductor component and evaluate whether its function is normal. The solder balls on the bottom surface of the chip are made of metal materials. During the repeated testing process, after the tip of the probe repeatedly touches the ...

Claims

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Application Information

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IPC IPC(8): G01R1/067G01R1/073B08B1/00B08B13/00
CPCB08B13/00G01R1/073G01R1/067B08B1/165Y02E10/50
Inventor 贺涛金永斌丁宁朱伟
Owner FTDEVICE TECH (SUZHOU) CO LTD
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