Embedded etching groove machining device for integrated circuit semiconductor

Abstract

The invention relates to the technical field of integrated circuits, in particular to an embedded etching groove machining device for an integrated circuit semiconductor. The embedded etching groove machining device for the integrated circuit semiconductor comprises a conveying device, a workbench, a rotating device, fixing devices, a moving device, a lifting device, a grooving device and a cleaning device, the conveying device is arranged on the horizontal plane, the workbench is fixedly arranged on the horizontal plane, the rotating device is arranged on the workbench, the fixing devices aresymmetrically arranged on the workbench, the moving device is arranged at the top of the workbench, the lifting device is arranged right above the workbench, the grooving device is arranged at the bottom of the lifting end of the lifting device, the cleaning device is arranged on the workbench, the conveying device carries out conveying on the integrated circuit semiconductor, the fixing devicescarry out fixation on the integrated circuit semiconductor, the grooving device carries out grooving on the integrated circuit semiconductor, the moving device and the rotating device carry out grooving on the integrated circuit semiconductor at different positions, and the cleaning device carries out removal on waste chips generated during grooving of the integrated circuit semiconductor.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an integrated circuit semiconductor embedded etching groove processing device. Background technique [0002] An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , and become a microstructure with required circuit functions; all the components in it have been structurally integrated, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. Integrated circuits have the advantages of small size, light weight, fewer lead wires and soldering points, long life, high reliability, good performance, etc., and at the same time low cost and...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide an integrated circuit semiconductor embedded etching groove processing device to solve the problem that the position is fixed and the position is inconvenient to rotate when the integrated circuit semiconductor is removed for etching groove processing in the prior art. The efficiency of groove processing is low, and the waste of etching groove processing on integrated circuit semiconductors cannot be cleaned in time, which will cause errors, which will affect the work of the deburring device

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