Leveling device in semiconductor heat treatment equipment and semiconductor heat treatment equipment

Abstract

The invention provides a leveling device in semiconductor heat treatment equipment and the semiconductor heat treatment equipment. The leveling device comprises an elastic component, a first connecting part and a second connecting part; the first connecting part is connected with one of a sealing door and a supporting part, and a first accommodating groove is formed in the first connecting part; the second connecting part is connected with the other one of the sealing door and the supporting part; a second accommodating groove opposite to the first accommodating groove is formed in the secondconnecting part; the first connecting part and the second connecting part are connected in a clamped mode and can relatively move in the elastic deformation direction of the elastic component during clamping; and the elastic component is arranged in a containing space defined by the first containing groove and the second containing groove in a matched mode. According to the leveling device in thesemiconductor heat treatment equipment and the semiconductor heat treatment equipment provided, the mounting difficulty of the leveling device can be reduced, the failure probability of the leveling device is reduced, and the use stability of the leveling device is improved, so that the sealing stability of a process door assembly is improved, and the stability of a semiconductor heat treatment process is improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor equipment, in particular to a leveling device in semiconductor heat treatment equipment and semiconductor heat treatment equipment. Background technique [0002] The process door of the semiconductor vertical furnace equipment is not only used to contact and seal the process chamber during the process, so as to ensure the sealing requirements of the semiconductor process, but also has a crystal boat for carrying wafers installed on it. The wafer to be processed is transferred to the process chamber for processing, or the processed wafer is transferred out of the process chamber to be taken away. However, due to assembly and processing errors, there will inevitably be certain errors in the levelness of the two surfaces where the process door and the process chamber are in contact with each other, resulting in some gaps between the process door and the process chamber. Completely seal...

AI Technical Summary

Problems solved by technology

[0004] However, due to the long length and small diameter of the connecting bolts, when installing the existing leveling device, the compression spring needs to be pre-compressed while screwing in the connecting bolts, which will bring greater resistance to the screwing in of the connecting bolts , it will cause the connecting bolts to be stuck or bent due to excessive screwing torque or asynchronous screwing of multiple connecting bolts, which has high requirements for installation and makes installation difficult

Moreover, when using the existing leveling device, when the compression degree of multiple compression springs is uneven, radial thrust will be generated on each connecting bolt, which will cause bending deformation of the connecting bolts in the long run, making the adjustment of the leveling device difficult. The flat function is affected or even fails, causing the process gate and the process chamber to not be completely sealed, resulting in the failure of the semiconductor process to proceed normally

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