Image line detection method of camera module

Abstract

The invention discloses an image line detection method of a camera module. The image line detection method comprises the following steps: S1, capturing at least one picture in a predetermined scene range from a to-be-detected camera module; S2, judging whether dead pixels exist in the picture or not; and S3, judging whether the difference value of each pixel group of the defective-point-free picture exceeds a preset difference value or not. According to the image line detection method of the camera module, the camera module captures a picture and performs defective pixel compensation on the picture, and then judges whether the difference value between the pixel comprehensive brightness value of the Nth group and the pixel comprehensive brightness value of the (N + / -i) th group exceeds a preset difference value or not; according to the technical scheme, whether the camera module image has the lines or not can be detected, severe line defects and slight line defects of the camera moduleimage are covered, the existence of the image lines can be found before a client side is on a computer, customer complaints are reduced, and the quality and the reputation of products are guaranteed.

Description

technical field [0001] The invention relates to the technical field of camera module quality detection, in particular to a method for detecting image lines of a camera module. Background technique [0002] It is pointed out in the relevant technology that if dust is mixed into the wiring layer in the silicon base during the wafer manufacturing process of the camera chip, the foreign matter embedded in the wiring layer will cause the resistance value to increase, resulting in "defective lines". [0003] Because the line defect can be slightly serious, the existing camera module black dot image quality testing technology cannot cover the image line test, and the slight line defect will be shipped as a good product, and the client needs to dismantle the image line after it is installed. The machine is repaired and replaced, and customer complaints occur, which seriously affects the quality and reputation of the product. Contents of the invention [0004] The present inventio...

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Problems solved by technology

[0002] It is pointed out in related technologies that if dust is mixed into the wiring layer in the silicon base during the wafer manufacturing process of the camera chip, the foreign matter embedded in the wiring layer will cause the resistance value to rise High, resulting in "bad lines"

[0003]Because there are slight and severe line defects, the existing camera module black point image quality testing technology cannot cover the image line test, and slight line defects will be regarded as Good products are shipped, but the client needs to disassemble the machine for repair and replacement after the client installs the machine, and customer complaints occur, seriously affecting the quality and reputation of the product

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