Small-hole gravity type solder ball array method and process

Abstract

The invention discloses a small-hole gravity type solder ball array method and process, and the method comprises the following steps: arranging a solder ball discharging plate on an operation platformwhich can achieve the inclination and turnover control, and arranging a ball taking and feeding plate which can move left and right and up and down above the solder ball discharging plate, processingarray type cup-shaped miniature small holes in the upper solder ball taking plate and a lower solder ball taking plate, the cup-shaped miniature small holes in the upper solder ball taking plate corresponding to the cup-shaped miniature small holes in the lower solder ball plate, and installing vacuum cavity supporting plates at the bottom of the lower solder ball plate and the top of the upper solder ball taking plate. And the vacuum cavity in a vacuum cavity support plate is communicated with the cup-shaped micro small holes in the solder ball lower ball plate and the ball taking upper ballplate. The solder ball bin is controlled to enable the solder balls to fall onto the ball discharging plate under the action of gravity and negative pressure, then the solder balls are controlled toreset and close the negative pressure of the ball discharging plate, the redundant solder balls are taken away under the dual action of gravity and a scraper, the ball taking and feeding plate is controlled to transfer the solder balls into the solder balls, and the capacity of full-automatic BGA packaging production is improved. And the implantation precision and the ball mounting efficiency of the solder balls are improved.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing and packaging, in particular to a small hole gravity solder ball array method and process. Background technique [0002] With the rise of the semiconductor industry, the demand for chips is increasing. The method and process of chip manufacturing cannot keep up with the production capacity. In the packaging of chip manufacturing, a large number of solder balls will be implanted, and because the solder balls are small, And it needs to be distributed in a high-precision array, so the solder ball implantation is more complicated, and its arrangement is troublesome. In the existing chip manufacturing solder ball planting process, most of them are semi-automatic ball placement, stencil ball placement, single-point ball placement, etc. method, but it is far from meeting the production capacity requirements. There are problems of low efficiency, low production capacity, and low precision, whic...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a small hole gravity solder ball array method and process, which is used for batch distribution of balls in the pre-automatic production of BGA packaging and solves the problems of low production capacity and poor precision

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