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3OZ thick copper plate one-time resistance welding process spraying method

A thick copper plate, one-off technology, applied in coating, spray booth, spray device and other directions, can solve the problems of long process flow, low efficiency and high production cost, and achieve the effect of cost reduction, efficiency improvement and good wrapping

Pending Publication Date: 2021-01-29
泰和电路科技(惠州)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention discloses a spraying method of one-time solder resist process for 3OZ thick copper plate, the purpose of which is to solve the problems of long process flow, low efficiency and high production cost when 3OZ thick copper plate goes through solder resist process twice

Method used

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  • 3OZ thick copper plate one-time resistance welding process spraying method
  • 3OZ thick copper plate one-time resistance welding process spraying method
  • 3OZ thick copper plate one-time resistance welding process spraying method

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Embodiment Construction

[0019] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0020] refer to figure 1 , a kind of 3OZ thick copper plate one-time solder resist process spraying method disclosed by the present invention, comprising:

[0021] S1: install a heating device in the spraying machine, and set the temperature in the spraying room;

[0022] S2: First put the short side of the 3OZ thick copper plate into the spraying room, spray twice in the spraying room at one time, take it out and let it stand for 5-10 minutes, let the ink flow freely and level off, then put the long side of the 3OZ thick copper plate into the spraying room The chamber is sprayed twice at one time, and the ratio of wet film thickness to actual dry film thickness is controlled at 1:0.45.

[0023] Through step S1, the spray ink can be pre-cured du...

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Abstract

The invention discloses a 3OZ thick copper plate one-time resistance welding process spraying method. The method comprises the following steps that a heating device is installed in a spraying machine,and the temperature in a spraying chamber is set; and the short edge of a 3OZ thick copper plate is placed into the spraying chamber, spraying is conducted twice in the spraying chamber at a time, the short edge of the 3OZ thick copper plate is taken out and stands for 5-10 min, then ink flows freely and is flattened, then the long edge of the 3OZ thick copper plate is placed into the spraying chamber to be subjected to one-time spraying twice, and the ratio of the wet film thickness to the actual dry film thickness is controlled to be 1: 0.45. The working principle of the spraying machine isutilized, and the pre-curing function in the spraying process is integrated; and meanwhile, the spraying mode of the 3OZ thick copper plate is changed, and the spraying ink can be manufactured by adopting special viscosity control to achieve the one-time resistance welding process of the 3OZ thick copper plate.

Description

technical field [0001] The invention belongs to the field of thick copper plate spraying, and in particular relates to a 3OZ thick copper plate spraying method for one-time solder resist process. Background technique [0002] Due to the thick copper thickness of 3OZ PCB thick copper plate, quality defects such as false exposed copper are prone to occur in one-time solder resist screen printing, and it is difficult to meet the ink thickness required by customers. Therefore, 3OZ thick copper plate factories generally use two solder mask processes or linemask process to produce. When the 3OZ PCB thick copper board goes through the solder resist process twice, the process is long, the efficiency is low, the production cost is high, and the process is easy to cause scratches and other quality abnormalities. Contents of the invention [0003] The invention discloses a spraying method for a one-time solder resist process of a 3OZ thick copper plate, and aims to solve the problems...

Claims

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Application Information

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IPC IPC(8): B05D7/14B05D1/02B05B16/20B05D3/02
CPCB05D7/14B05D1/02B05B16/20B05D3/0263B05D2202/45
Inventor 丁敏达黄振伦王国李艳国
Owner 泰和电路科技(惠州)有限公司
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