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Flexible sensor array

A flexible sensor and array technology, applied in the field of flexible sensors, can solve the problems of less research on flexible array sensors, low material utilization, and low efficiency, and achieve the effect of simple structure, high material utilization, and thin thickness

Pending Publication Date: 2021-01-15
CHONGQING UNIV OF ARTS & SCI
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AI Technical Summary

Problems solved by technology

[0003] Although flexible pressure sensor technology has been greatly developed in recent years, there are few studies on large-area flexible array sensors.
In large-area integrated applications, the existing sensor based on the coating process generally prepares the pressure-sensitive layer first, and then cuts and installs it according to the application requirements. The material utilization rate is low, the thickness is too large, and the cost is too high
Secondly, the efficiency is too low, and large-area integration is only repeated installation and production of a single sensor, which is not suitable for the production of large-area high-density flexible array sensors.

Method used

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Embodiment Construction

[0028] The technical solutions provided by the present invention will be further described below in conjunction with the accompanying drawings.

[0029] In the flexible sensors of the prior art, the preparation of the pressure-sensitive film is mostly achieved by means of uniform glue, etc. After curing and molding, the pressure-sensitive layer of the desired shape is obtained from the film. This process is too inefficient and the material utilization The efficiency is also low, which is not suitable for the preparation of large-area sensing arrays.

[0030] see figure 1 , which is a structural block diagram of a flexible sensor array provided by the present invention, which adopts a "sandwich" type sandwich structure, and sequentially arranges a first electrode array substrate, an insulating adhesive layer, a composite pressure-sensitive layer and a second electrode array substrate, wherein, the Both the first electrode array substrate and the second electrode array substrat...

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Abstract

The invention discloses a flexible sensor array which is sequentially provided with a first electrode array substrate, an insulating glue layer, a composite pressure-sensitive layer and a second electrode array substrate, and is characterized in that the first electrode array substrate and the second electrode array substrate respectively form a first electrode array and a second electrode array by arranging electrode arrays on a flexible substrate; any point electrode of the first electrode array and one point electrode of the second electrode array are in one-to-one correspondence to form anelectrode group. According to the invention, a large-area sensor array can be realized, the pressure-sensitive array and the electrode array have better connectivity and better adhesive force, the size is smaller, the preparation efficiency is higher, and the repeated installation process of the pressure-sensitive layer is avoided.

Description

technical field [0001] The invention relates to the technical field of flexible sensors, in particular to a flexible sensor array. Background technique [0002] With the improvement of technology and modernization level, people have higher and higher requirements for pressure monitoring. It is not limited to pressure monitoring on regular rigid surfaces, and there are also various forms. Ordinary rigid sensors can no longer meet people's actual needs. For example, people hope to realize real-time monitoring of physiological indicators such as heartbeat, pulse, blood pressure, respiration, etc. through wearable, stickable or even implantable methods. In addition to taking into account accuracy and safety, these products must also take into account the human body. Comfortable to wear, it can withstand various daily movements of the human body, even heavy-duty sports without affecting the performance indicators of the sensor. Due to its random bending or even folding, small si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/16G01L9/08
CPCG01L1/16G01L9/08
Inventor 闫兴武李颖李璐石一非柏栋予
Owner CHONGQING UNIV OF ARTS & SCI
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